JPS52127165A - Airtight container for semiconductor - Google Patents
Airtight container for semiconductorInfo
- Publication number
- JPS52127165A JPS52127165A JP4457776A JP4457776A JPS52127165A JP S52127165 A JPS52127165 A JP S52127165A JP 4457776 A JP4457776 A JP 4457776A JP 4457776 A JP4457776 A JP 4457776A JP S52127165 A JPS52127165 A JP S52127165A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- airtight container
- seramic
- convering
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To obtain high reliable semiconductor container by narrow-fusion welding the metal lead between the seramic substrate and the convering body by the use of low melting point glass and by increasing the seal path.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4457776A JPS52127165A (en) | 1976-04-19 | 1976-04-19 | Airtight container for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4457776A JPS52127165A (en) | 1976-04-19 | 1976-04-19 | Airtight container for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52127165A true JPS52127165A (en) | 1977-10-25 |
Family
ID=12695347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4457776A Pending JPS52127165A (en) | 1976-04-19 | 1976-04-19 | Airtight container for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52127165A (en) |
-
1976
- 1976-04-19 JP JP4457776A patent/JPS52127165A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS548462A (en) | Manufacture for semiconductor | |
JPS531469A (en) | Glass seal type semiconductor device | |
JPS5380966A (en) | Manufacture of electrode fdr semiconductor device | |
JPS52127165A (en) | Airtight container for semiconductor | |
JPS53105366A (en) | Manufacture for semiconductor element substrate | |
JPS549582A (en) | Sealing method of semiconductor device | |
JPS537173A (en) | Solder-sealed ceramic package | |
JPS52139370A (en) | Semiconductor device | |
JPS52149067A (en) | Glass mold type semiconductor device | |
JPS51122377A (en) | Manufacturing method of glass sealed semiconductor | |
JPS51126762A (en) | Integrated circuit manufacturing process | |
JPS5374368A (en) | Package for semiconductor device | |
JPS52141565A (en) | Manufacture of semiconductor unit | |
JPS5372469A (en) | Manufacture for semiconductor | |
JPS52155972A (en) | Production of semiconductor device | |
JPS52100977A (en) | Hermetic seal type semiconductor device | |
JPS51122375A (en) | Semiconductor device | |
JPS5275874A (en) | Method of sealing mercury in bulb or like | |
JPS51111419A (en) | Alloy for sealing the soft glass | |
JPS51142274A (en) | Electrode lead for semiconductor device | |
JPS5433386A (en) | Bulb | |
JPS52127760A (en) | Glass-seal type semiconductor unit | |
JPS51132894A (en) | Gas sensitive body | |
JPS51147966A (en) | Plasma etching process | |
JPS52128062A (en) | Microwave ic |