JPS5434686A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5434686A
JPS5434686A JP10129877A JP10129877A JPS5434686A JP S5434686 A JPS5434686 A JP S5434686A JP 10129877 A JP10129877 A JP 10129877A JP 10129877 A JP10129877 A JP 10129877A JP S5434686 A JPS5434686 A JP S5434686A
Authority
JP
Japan
Prior art keywords
semiconductor device
solder
surrounding
substrate
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10129877A
Other languages
Japanese (ja)
Inventor
Takeshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10129877A priority Critical patent/JPS5434686A/en
Publication of JPS5434686A publication Critical patent/JPS5434686A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

PURPOSE: To secure soldering between the substrate and the metal electrode with sufficient amount of solder by surrounding the soldered area on the main surface with the insulating protective film.
COPYRIGHT: (C)1979,JPO&Japio
JP10129877A 1977-08-23 1977-08-23 Semiconductor device Pending JPS5434686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10129877A JPS5434686A (en) 1977-08-23 1977-08-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10129877A JPS5434686A (en) 1977-08-23 1977-08-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5434686A true JPS5434686A (en) 1979-03-14

Family

ID=14296906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10129877A Pending JPS5434686A (en) 1977-08-23 1977-08-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5434686A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731862U (en) * 1980-07-30 1982-02-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731862U (en) * 1980-07-30 1982-02-19

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