JPS5293271A - Semiconductor device and its manufacture for that device - Google Patents

Semiconductor device and its manufacture for that device

Info

Publication number
JPS5293271A
JPS5293271A JP931776A JP931776A JPS5293271A JP S5293271 A JPS5293271 A JP S5293271A JP 931776 A JP931776 A JP 931776A JP 931776 A JP931776 A JP 931776A JP S5293271 A JPS5293271 A JP S5293271A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
base plate
semiconductor
beteen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP931776A
Other languages
Japanese (ja)
Inventor
Tasao Soga
Tomiro Yasuda
Masataka Kasai
Mamoru Sawahata
Susumu Kurokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP931776A priority Critical patent/JPS5293271A/en
Publication of JPS5293271A publication Critical patent/JPS5293271A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent from coming off of a conductive terminal from a base plate and also protect it and enhance a thermal stabilization in the semiconductor device soldered with a semiconductor element beteen at least a pair of the conductive terminals fitted at the base plate.
COPYRIGHT: (C)1977,JPO&Japio
JP931776A 1976-02-02 1976-02-02 Semiconductor device and its manufacture for that device Pending JPS5293271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP931776A JPS5293271A (en) 1976-02-02 1976-02-02 Semiconductor device and its manufacture for that device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP931776A JPS5293271A (en) 1976-02-02 1976-02-02 Semiconductor device and its manufacture for that device

Publications (1)

Publication Number Publication Date
JPS5293271A true JPS5293271A (en) 1977-08-05

Family

ID=11717082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP931776A Pending JPS5293271A (en) 1976-02-02 1976-02-02 Semiconductor device and its manufacture for that device

Country Status (1)

Country Link
JP (1) JPS5293271A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471198A (en) * 1987-09-11 1989-03-16 Hitachi Ltd Printed substrate for mounting multiterminal parts
JPH09186439A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Printed board for mounting multi-terminal component
JPH09186441A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Method for mounting multi-terminal component
JPH09186440A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Printed board for mounting multi-terminal component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471198A (en) * 1987-09-11 1989-03-16 Hitachi Ltd Printed substrate for mounting multiterminal parts
JPH09186439A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Printed board for mounting multi-terminal component
JPH09186441A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Method for mounting multi-terminal component
JPH09186440A (en) * 1997-01-13 1997-07-15 Hitachi Ltd Printed board for mounting multi-terminal component

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