JPS5253670A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5253670A
JPS5253670A JP50129213A JP12921375A JPS5253670A JP S5253670 A JPS5253670 A JP S5253670A JP 50129213 A JP50129213 A JP 50129213A JP 12921375 A JP12921375 A JP 12921375A JP S5253670 A JPS5253670 A JP S5253670A
Authority
JP
Japan
Prior art keywords
semiconductor device
increased
heat radiation
effect
main electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50129213A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Hideki Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50129213A priority Critical patent/JPS5253670A/en
Publication of JPS5253670A publication Critical patent/JPS5253670A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: Good thermal conductors are provided between the main electrode forming surface of an element and the surface of an outside housing, whereby the effect of heat radiation is increased.
COPYRIGHT: (C)1977,JPO&Japio
JP50129213A 1975-10-29 1975-10-29 Semiconductor device Pending JPS5253670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50129213A JPS5253670A (en) 1975-10-29 1975-10-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50129213A JPS5253670A (en) 1975-10-29 1975-10-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5253670A true JPS5253670A (en) 1977-04-30

Family

ID=15003921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50129213A Pending JPS5253670A (en) 1975-10-29 1975-10-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5253670A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (en) * 1985-11-13 1987-05-26 Nec Corp Heat sink structure for integrated circuit
JPH05315507A (en) * 1992-05-12 1993-11-26 Nec Corp Semiconductor integrated circuit chip and semiconductor device
JP2006222235A (en) * 2005-02-09 2006-08-24 Seiko Instruments Inc Semiconductor device and its manufacturing method, and mounting method of semiconductor chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118696U (en) * 1974-07-30 1976-02-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5118696U (en) * 1974-07-30 1976-02-10

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (en) * 1985-11-13 1987-05-26 Nec Corp Heat sink structure for integrated circuit
JPH05315507A (en) * 1992-05-12 1993-11-26 Nec Corp Semiconductor integrated circuit chip and semiconductor device
JP2006222235A (en) * 2005-02-09 2006-08-24 Seiko Instruments Inc Semiconductor device and its manufacturing method, and mounting method of semiconductor chip

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