JPS5225572A - Resin-seal type semiconductor device - Google Patents

Resin-seal type semiconductor device

Info

Publication number
JPS5225572A
JPS5225572A JP10121075A JP10121075A JPS5225572A JP S5225572 A JPS5225572 A JP S5225572A JP 10121075 A JP10121075 A JP 10121075A JP 10121075 A JP10121075 A JP 10121075A JP S5225572 A JPS5225572 A JP S5225572A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
type semiconductor
seal type
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10121075A
Other languages
Japanese (ja)
Inventor
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10121075A priority Critical patent/JPS5225572A/en
Publication of JPS5225572A publication Critical patent/JPS5225572A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a semiconductor device with excellent radiation effect, by means of radiating the heat being generated from a semiconductor element from each one of leads other than the tab lead.
COPYRIGHT: (C)1977,JPO&Japio
JP10121075A 1975-08-22 1975-08-22 Resin-seal type semiconductor device Pending JPS5225572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10121075A JPS5225572A (en) 1975-08-22 1975-08-22 Resin-seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10121075A JPS5225572A (en) 1975-08-22 1975-08-22 Resin-seal type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5225572A true JPS5225572A (en) 1977-02-25

Family

ID=14294545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10121075A Pending JPS5225572A (en) 1975-08-22 1975-08-22 Resin-seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5225572A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629352A (en) * 1979-08-17 1981-03-24 Nec Corp Resin-sealed semiconductor device
US4402311A (en) * 1979-03-30 1983-09-06 Olympus Optical Co., Ltd. Endoscope for medical treatment
JPS61211978A (en) * 1985-03-15 1986-09-20 株式会社サーモ理工 Radiation heater
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
JPH0392392U (en) * 1990-01-10 1991-09-19

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4402311A (en) * 1979-03-30 1983-09-06 Olympus Optical Co., Ltd. Endoscope for medical treatment
JPS5629352A (en) * 1979-08-17 1981-03-24 Nec Corp Resin-sealed semiconductor device
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
US5010390A (en) * 1983-08-31 1991-04-23 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
JPS61211978A (en) * 1985-03-15 1986-09-20 株式会社サーモ理工 Radiation heater
JPH0392392U (en) * 1990-01-10 1991-09-19

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