JPS51126067A - Resin sealing form semi-conductor equipment - Google Patents

Resin sealing form semi-conductor equipment

Info

Publication number
JPS51126067A
JPS51126067A JP4966975A JP4966975A JPS51126067A JP S51126067 A JPS51126067 A JP S51126067A JP 4966975 A JP4966975 A JP 4966975A JP 4966975 A JP4966975 A JP 4966975A JP S51126067 A JPS51126067 A JP S51126067A
Authority
JP
Japan
Prior art keywords
resin sealing
form semi
sealing form
conductor equipment
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4966975A
Other languages
Japanese (ja)
Inventor
Kiyoshi Shimizu
Naohiko Takeshige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4966975A priority Critical patent/JPS51126067A/en
Publication of JPS51126067A publication Critical patent/JPS51126067A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: Resin sealing form semi-conductor equipment being able to easily combine elements and also to establish a radiator able to radiate effectively the heat from the pellet.
COPYRIGHT: (C)1976,JPO&Japio
JP4966975A 1975-04-25 1975-04-25 Resin sealing form semi-conductor equipment Pending JPS51126067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4966975A JPS51126067A (en) 1975-04-25 1975-04-25 Resin sealing form semi-conductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4966975A JPS51126067A (en) 1975-04-25 1975-04-25 Resin sealing form semi-conductor equipment

Publications (1)

Publication Number Publication Date
JPS51126067A true JPS51126067A (en) 1976-11-02

Family

ID=12837565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4966975A Pending JPS51126067A (en) 1975-04-25 1975-04-25 Resin sealing form semi-conductor equipment

Country Status (1)

Country Link
JP (1) JPS51126067A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295808A (en) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp Resin-molded semiconductor module
JP2010199494A (en) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp Semiconductor device and manufacturing method of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924071A (en) * 1972-06-26 1974-03-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924071A (en) * 1972-06-26 1974-03-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295808A (en) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp Resin-molded semiconductor module
JP2010199494A (en) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp Semiconductor device and manufacturing method of the same

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