JPS51132969A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51132969A
JPS51132969A JP50057977A JP5797775A JPS51132969A JP S51132969 A JPS51132969 A JP S51132969A JP 50057977 A JP50057977 A JP 50057977A JP 5797775 A JP5797775 A JP 5797775A JP S51132969 A JPS51132969 A JP S51132969A
Authority
JP
Japan
Prior art keywords
semiconductor device
heat radiation
semiconductor chips
plates
bonded simultaneously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50057977A
Other languages
Japanese (ja)
Other versions
JPS571143B2 (en
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50057977A priority Critical patent/JPS51132969A/en
Publication of JPS51132969A publication Critical patent/JPS51132969A/en
Publication of JPS571143B2 publication Critical patent/JPS571143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: Metal plates for heat radiation are bonded simultaneously on semiconductor chips, and the heat radiation plates and semiconductor chips are connected.
COPYRIGHT: (C)1976,JPO&Japio
JP50057977A 1975-05-15 1975-05-15 Semiconductor device Granted JPS51132969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50057977A JPS51132969A (en) 1975-05-15 1975-05-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50057977A JPS51132969A (en) 1975-05-15 1975-05-15 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS51132969A true JPS51132969A (en) 1976-11-18
JPS571143B2 JPS571143B2 (en) 1982-01-09

Family

ID=13071053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50057977A Granted JPS51132969A (en) 1975-05-15 1975-05-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51132969A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151549U (en) * 1982-04-02 1983-10-11 凸版印刷株式会社 Quantitative dispensing container

Also Published As

Publication number Publication date
JPS571143B2 (en) 1982-01-09

Similar Documents

Publication Publication Date Title
DE2966008D1 (en) Device for the precise alignment of planar workpieces, e.g. semiconductor wafers
JPS5230162A (en) Semiconductor device
JPS51132969A (en) Semiconductor device
JPS5210032A (en) Construction method of semiconductor memory unit
JPS5237770A (en) Semiconductor device
JPS5210946A (en) Cooling and heating device
JPS52147065A (en) Semiconductor device
JPS5220783A (en) Semi-conductor unit
JPS5236980A (en) Heat sink for semiconductor devices
JPS51113572A (en) Centering method for electronic ray picture and the unit using the sai d method
JPS5232140A (en) Heat absorbing device
JPS5226189A (en) Semi-conductor unit of multilayer wiring structure
JPS5411690A (en) Semiconductor laser unit
JPS529134A (en) High-frequency heating device
JPS51127418A (en) Brake circuit for motor
JPS5223274A (en) Self-matching type semiconductor device
JPS51126067A (en) Resin sealing form semi-conductor equipment
JPS51120457A (en) Fin-attached heat exchanger
JPS51135465A (en) Semi-conductor unit
JPS51144577A (en) Semiconductor device
JPS5286064A (en) Semiconductor device
JPS5213773A (en) Semiconductor unit manufacturing process
JPS5399764A (en) Semiconductor device having bonding pad
JPS5245871A (en) Semiconductor device
JPS5230383A (en) Semiconductor device