JPS51144577A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51144577A
JPS51144577A JP6872875A JP6872875A JPS51144577A JP S51144577 A JPS51144577 A JP S51144577A JP 6872875 A JP6872875 A JP 6872875A JP 6872875 A JP6872875 A JP 6872875A JP S51144577 A JPS51144577 A JP S51144577A
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding pad
alminium
bump
simplifying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6872875A
Other languages
Japanese (ja)
Inventor
Katsuki Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP6872875A priority Critical patent/JPS51144577A/en
Publication of JPS51144577A publication Critical patent/JPS51144577A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: In a semiconductor device having a Alminium bonding pad, simplifying the process for forming a bump on a bonding pad and reducing its cost.
COPYRIGHT: (C)1976,JPO&Japio
JP6872875A 1975-06-06 1975-06-06 Semiconductor device Pending JPS51144577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6872875A JPS51144577A (en) 1975-06-06 1975-06-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6872875A JPS51144577A (en) 1975-06-06 1975-06-06 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51144577A true JPS51144577A (en) 1976-12-11

Family

ID=13382134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6872875A Pending JPS51144577A (en) 1975-06-06 1975-06-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51144577A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650539A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650539A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device

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