JPS5360576A - Flip chip bonding device - Google Patents

Flip chip bonding device

Info

Publication number
JPS5360576A
JPS5360576A JP13614976A JP13614976A JPS5360576A JP S5360576 A JPS5360576 A JP S5360576A JP 13614976 A JP13614976 A JP 13614976A JP 13614976 A JP13614976 A JP 13614976A JP S5360576 A JPS5360576 A JP S5360576A
Authority
JP
Japan
Prior art keywords
flip chip
chip bonding
bonding device
mounting
bump height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13614976A
Other languages
Japanese (ja)
Inventor
Keisuke Hidaka
Masayuki Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13614976A priority Critical patent/JPS5360576A/en
Publication of JPS5360576A publication Critical patent/JPS5360576A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Abstract

PURPOSE: To perform satisfactory bonding despite irregularity in bump height by providing flexibility in mounting of a die collet.
COPYRIGHT: (C)1978,JPO&Japio
JP13614976A 1976-11-11 1976-11-11 Flip chip bonding device Pending JPS5360576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13614976A JPS5360576A (en) 1976-11-11 1976-11-11 Flip chip bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13614976A JPS5360576A (en) 1976-11-11 1976-11-11 Flip chip bonding device

Publications (1)

Publication Number Publication Date
JPS5360576A true JPS5360576A (en) 1978-05-31

Family

ID=15168445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13614976A Pending JPS5360576A (en) 1976-11-11 1976-11-11 Flip chip bonding device

Country Status (1)

Country Link
JP (1) JPS5360576A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169731A (en) * 1987-01-08 1988-07-13 Shinkawa Ltd Tool holding mechanism for bonder
JPH0487345A (en) * 1990-07-30 1992-03-19 Nippon Steel Corp Bonding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169731A (en) * 1987-01-08 1988-07-13 Shinkawa Ltd Tool holding mechanism for bonder
JPH0487345A (en) * 1990-07-30 1992-03-19 Nippon Steel Corp Bonding apparatus

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