JPS5220783A - Semi-conductor unit - Google Patents

Semi-conductor unit

Info

Publication number
JPS5220783A
JPS5220783A JP9734475A JP9734475A JPS5220783A JP S5220783 A JPS5220783 A JP S5220783A JP 9734475 A JP9734475 A JP 9734475A JP 9734475 A JP9734475 A JP 9734475A JP S5220783 A JPS5220783 A JP S5220783A
Authority
JP
Japan
Prior art keywords
semi
conductor unit
conductor
removal
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9734475A
Other languages
Japanese (ja)
Other versions
JPS5311836B2 (en
Inventor
Goji Kawakami
Ganzo Iwane
Yoshitaka Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP9734475A priority Critical patent/JPS5220783A/en
Publication of JPS5220783A publication Critical patent/JPS5220783A/en
Publication of JPS5311836B2 publication Critical patent/JPS5311836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: Removal of the mounting distortion by using liquid metal between the semi-conductor element and the heat sink.
COPYRIGHT: (C)1977,JPO&Japio
JP9734475A 1975-08-11 1975-08-11 Semi-conductor unit Granted JPS5220783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9734475A JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9734475A JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Publications (2)

Publication Number Publication Date
JPS5220783A true JPS5220783A (en) 1977-02-16
JPS5311836B2 JPS5311836B2 (en) 1978-04-25

Family

ID=14189850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9734475A Granted JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Country Status (1)

Country Link
JP (1) JPS5220783A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422186A (en) * 1977-07-20 1979-02-19 Matsushita Electric Ind Co Ltd Light emitting diode device
JP2015018843A (en) * 2013-07-09 2015-01-29 三菱電機株式会社 Method of manufacturing power semiconductor device and power semiconductor device
JP2015174129A (en) * 2014-03-17 2015-10-05 株式会社日本スペリア社 Liquid metal joining material and joining method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422186A (en) * 1977-07-20 1979-02-19 Matsushita Electric Ind Co Ltd Light emitting diode device
JP2015018843A (en) * 2013-07-09 2015-01-29 三菱電機株式会社 Method of manufacturing power semiconductor device and power semiconductor device
JP2015174129A (en) * 2014-03-17 2015-10-05 株式会社日本スペリア社 Liquid metal joining material and joining method therefor

Also Published As

Publication number Publication date
JPS5311836B2 (en) 1978-04-25

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