JPS5220782A - Semi-conductor element mounting method - Google Patents

Semi-conductor element mounting method

Info

Publication number
JPS5220782A
JPS5220782A JP9734375A JP9734375A JPS5220782A JP S5220782 A JPS5220782 A JP S5220782A JP 9734375 A JP9734375 A JP 9734375A JP 9734375 A JP9734375 A JP 9734375A JP S5220782 A JPS5220782 A JP S5220782A
Authority
JP
Japan
Prior art keywords
semi
conductor element
mounting method
element mounting
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9734375A
Other languages
Japanese (ja)
Other versions
JPS5311835B2 (en
Inventor
Goji Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP9734375A priority Critical patent/JPS5220782A/en
Publication of JPS5220782A publication Critical patent/JPS5220782A/en
Publication of JPS5311835B2 publication Critical patent/JPS5311835B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Abstract

PURPOSE: Removal of the residual distortion by press-mounting the operation layer of semi-conductor element onto the heat sink without melting the soft metal.
COPYRIGHT: (C)1977,JPO&Japio
JP9734375A 1975-08-11 1975-08-11 Semi-conductor element mounting method Granted JPS5220782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9734375A JPS5220782A (en) 1975-08-11 1975-08-11 Semi-conductor element mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9734375A JPS5220782A (en) 1975-08-11 1975-08-11 Semi-conductor element mounting method

Publications (2)

Publication Number Publication Date
JPS5220782A true JPS5220782A (en) 1977-02-16
JPS5311835B2 JPS5311835B2 (en) 1978-04-25

Family

ID=14189822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9734375A Granted JPS5220782A (en) 1975-08-11 1975-08-11 Semi-conductor element mounting method

Country Status (1)

Country Link
JP (1) JPS5220782A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161690A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Manufacture of semiconductor laser device
JPS5764174U (en) * 1980-09-30 1982-04-16
JPS6323386A (en) * 1987-07-02 1988-01-30 Fujitsu Ltd Method for assemblying semiconductor laser
JPH0258622A (en) * 1988-08-20 1990-02-27 Nisshoku Corp Hydrophobic material for underdrainage
WO2011029846A1 (en) * 2009-09-09 2011-03-17 Jenoptik Laser Gmbh Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
JP2014036165A (en) * 2012-08-09 2014-02-24 Shinko Electric Ind Co Ltd Semiconductor device
JP2018507552A (en) * 2015-02-24 2018-03-15 イェノプティック レーザー ゲーエムベーハーＪｅｎｏｐｔｉｋ Ｌａｓｅｒ Ｇｍｂｈ Diode laser manufacturing method and diode laser

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161690A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Manufacture of semiconductor laser device
JPS5764174U (en) * 1980-09-30 1982-04-16
JPS6323386A (en) * 1987-07-02 1988-01-30 Fujitsu Ltd Method for assemblying semiconductor laser
JPH0156555B2 (en) * 1987-07-02 1989-11-30 Fujitsu Ltd
JPH0258622A (en) * 1988-08-20 1990-02-27 Nisshoku Corp Hydrophobic material for underdrainage
WO2011029846A1 (en) * 2009-09-09 2011-03-17 Jenoptik Laser Gmbh Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
CN102576975A (en) * 2009-09-09 2012-07-11 詹诺普蒂克激光有限公司 Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
US8486766B2 (en) 2009-09-09 2013-07-16 Jenoptik Laser Gmbh Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
JP2014036165A (en) * 2012-08-09 2014-02-24 Shinko Electric Ind Co Ltd Semiconductor device
JP2018507552A (en) * 2015-02-24 2018-03-15 イェノプティック レーザー ゲーエムベーハーＪｅｎｏｐｔｉｋ Ｌａｓｅｒ Ｇｍｂｈ Diode laser manufacturing method and diode laser

Also Published As

Publication number Publication date
JPS5311835B2 (en) 1978-04-25

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