JPS5225573A - Thin film formation method - Google Patents
Thin film formation methodInfo
- Publication number
- JPS5225573A JPS5225573A JP10123175A JP10123175A JPS5225573A JP S5225573 A JPS5225573 A JP S5225573A JP 10123175 A JP10123175 A JP 10123175A JP 10123175 A JP10123175 A JP 10123175A JP S5225573 A JPS5225573 A JP S5225573A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film formation
- formation method
- base
- adhering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Die Bonding (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To mitigate the stress being generated, by means of warping the base plate toward the backward, by adhering the same film on the backside of the base-plate before the adhering the insulation film or metal film on the surface of a semiconductor base-plate.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10123175A JPS5225573A (en) | 1975-08-22 | 1975-08-22 | Thin film formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10123175A JPS5225573A (en) | 1975-08-22 | 1975-08-22 | Thin film formation method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5225573A true JPS5225573A (en) | 1977-02-25 |
Family
ID=14295112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10123175A Pending JPS5225573A (en) | 1975-08-22 | 1975-08-22 | Thin film formation method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5225573A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5854639A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Semiconductor device |
JPS5854637A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Semiconductor device |
JPH07230871A (en) * | 1994-02-18 | 1995-08-29 | Nichifu Co Ltd | Connecting method for linear heating element |
-
1975
- 1975-08-22 JP JP10123175A patent/JPS5225573A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5854639A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Semiconductor device |
JPS5854637A (en) * | 1981-09-29 | 1983-03-31 | Fujitsu Ltd | Semiconductor device |
JPH07230871A (en) * | 1994-02-18 | 1995-08-29 | Nichifu Co Ltd | Connecting method for linear heating element |
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