JPS5225573A - Thin film formation method - Google Patents

Thin film formation method

Info

Publication number
JPS5225573A
JPS5225573A JP10123175A JP10123175A JPS5225573A JP S5225573 A JPS5225573 A JP S5225573A JP 10123175 A JP10123175 A JP 10123175A JP 10123175 A JP10123175 A JP 10123175A JP S5225573 A JPS5225573 A JP S5225573A
Authority
JP
Japan
Prior art keywords
thin film
film formation
formation method
base
adhering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10123175A
Other languages
Japanese (ja)
Inventor
Yoichi Tamaoki
Seiichi Isomae
Yukio Takano
Masahiko Kogirima
Michiyoshi Maki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10123175A priority Critical patent/JPS5225573A/en
Publication of JPS5225573A publication Critical patent/JPS5225573A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To mitigate the stress being generated, by means of warping the base plate toward the backward, by adhering the same film on the backside of the base-plate before the adhering the insulation film or metal film on the surface of a semiconductor base-plate.
COPYRIGHT: (C)1977,JPO&Japio
JP10123175A 1975-08-22 1975-08-22 Thin film formation method Pending JPS5225573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10123175A JPS5225573A (en) 1975-08-22 1975-08-22 Thin film formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10123175A JPS5225573A (en) 1975-08-22 1975-08-22 Thin film formation method

Publications (1)

Publication Number Publication Date
JPS5225573A true JPS5225573A (en) 1977-02-25

Family

ID=14295112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10123175A Pending JPS5225573A (en) 1975-08-22 1975-08-22 Thin film formation method

Country Status (1)

Country Link
JP (1) JPS5225573A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854639A (en) * 1981-09-29 1983-03-31 Fujitsu Ltd Semiconductor device
JPS5854637A (en) * 1981-09-29 1983-03-31 Fujitsu Ltd Semiconductor device
JPH07230871A (en) * 1994-02-18 1995-08-29 Nichifu Co Ltd Connecting method for linear heating element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854639A (en) * 1981-09-29 1983-03-31 Fujitsu Ltd Semiconductor device
JPS5854637A (en) * 1981-09-29 1983-03-31 Fujitsu Ltd Semiconductor device
JPH07230871A (en) * 1994-02-18 1995-08-29 Nichifu Co Ltd Connecting method for linear heating element

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