JPS5335375A - Heating method - Google Patents

Heating method

Info

Publication number
JPS5335375A
JPS5335375A JP10877876A JP10877876A JPS5335375A JP S5335375 A JPS5335375 A JP S5335375A JP 10877876 A JP10877876 A JP 10877876A JP 10877876 A JP10877876 A JP 10877876A JP S5335375 A JPS5335375 A JP S5335375A
Authority
JP
Japan
Prior art keywords
heating method
wafers
warpage
prevent
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10877876A
Other languages
Japanese (ja)
Inventor
Takaaki Aoshima
Akira Yoshinaka
Hirobumi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10877876A priority Critical patent/JPS5335375A/en
Publication of JPS5335375A publication Critical patent/JPS5335375A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the warpage of wafers by beforehand forming an impurity added layer or insulation film on the main surface of the heating side of the wafers.
COPYRIGHT: (C)1978,JPO&Japio
JP10877876A 1976-09-13 1976-09-13 Heating method Pending JPS5335375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10877876A JPS5335375A (en) 1976-09-13 1976-09-13 Heating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10877876A JPS5335375A (en) 1976-09-13 1976-09-13 Heating method

Publications (1)

Publication Number Publication Date
JPS5335375A true JPS5335375A (en) 1978-04-01

Family

ID=14493228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10877876A Pending JPS5335375A (en) 1976-09-13 1976-09-13 Heating method

Country Status (1)

Country Link
JP (1) JPS5335375A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197326A (en) * 1987-02-12 1988-08-16 Oki Electric Ind Co Ltd Formation of compound semiconductor substrate
JP2013149733A (en) * 2012-01-18 2013-08-01 Seiko Epson Corp Semiconductor substrate and semiconductor substrate manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197326A (en) * 1987-02-12 1988-08-16 Oki Electric Ind Co Ltd Formation of compound semiconductor substrate
JP2013149733A (en) * 2012-01-18 2013-08-01 Seiko Epson Corp Semiconductor substrate and semiconductor substrate manufacturing method

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