JPS52124861A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS52124861A
JPS52124861A JP4127376A JP4127376A JPS52124861A JP S52124861 A JPS52124861 A JP S52124861A JP 4127376 A JP4127376 A JP 4127376A JP 4127376 A JP4127376 A JP 4127376A JP S52124861 A JPS52124861 A JP S52124861A
Authority
JP
Japan
Prior art keywords
semiconductor element
bump electrodes
widening
metal layer
glass film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4127376A
Other languages
Japanese (ja)
Inventor
Hiroshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4127376A priority Critical patent/JPS52124861A/en
Publication of JPS52124861A publication Critical patent/JPS52124861A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To prevent cracking of glass film under bump electrodes by widening an underlaying metal layer to positions sufficiently away from directly under the bump electrodes.
COPYRIGHT: (C)1977,JPO&Japio
JP4127376A 1976-04-14 1976-04-14 Semiconductor element Pending JPS52124861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4127376A JPS52124861A (en) 1976-04-14 1976-04-14 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4127376A JPS52124861A (en) 1976-04-14 1976-04-14 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS52124861A true JPS52124861A (en) 1977-10-20

Family

ID=12603823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4127376A Pending JPS52124861A (en) 1976-04-14 1976-04-14 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS52124861A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202421B2 (en) 2003-01-30 2007-04-10 Seiko Epson Corporation Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202421B2 (en) 2003-01-30 2007-04-10 Seiko Epson Corporation Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices

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