JPS5389664A - Package structure of semiconductor device - Google Patents

Package structure of semiconductor device

Info

Publication number
JPS5389664A
JPS5389664A JP394677A JP394677A JPS5389664A JP S5389664 A JPS5389664 A JP S5389664A JP 394677 A JP394677 A JP 394677A JP 394677 A JP394677 A JP 394677A JP S5389664 A JPS5389664 A JP S5389664A
Authority
JP
Japan
Prior art keywords
semiconductor device
package structure
package
accelerating
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP394677A
Other languages
Japanese (ja)
Inventor
Hiroshi Momona
Hajime Murakami
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP394677A priority Critical patent/JPS5389664A/en
Publication of JPS5389664A publication Critical patent/JPS5389664A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To produce a package of good heat radiating characteristics by accelerating the heat radiation from the base side fixing a pellet.
COPYRIGHT: (C)1978,JPO&Japio
JP394677A 1977-01-19 1977-01-19 Package structure of semiconductor device Pending JPS5389664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP394677A JPS5389664A (en) 1977-01-19 1977-01-19 Package structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP394677A JPS5389664A (en) 1977-01-19 1977-01-19 Package structure of semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP15780983A Division JPS5980948A (en) 1983-08-31 1983-08-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5389664A true JPS5389664A (en) 1978-08-07

Family

ID=11571276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP394677A Pending JPS5389664A (en) 1977-01-19 1977-01-19 Package structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5389664A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107063A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor package
JPS57130454A (en) * 1981-02-06 1982-08-12 Nec Corp Chip carrier
JPS59134852A (en) * 1983-01-21 1984-08-02 Hitachi Ltd Integrated circuit package
US4556899A (en) * 1981-06-05 1985-12-03 Hitachi, Ltd. Insulated type semiconductor devices
JPS61147558A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor housing case
JPS62124855U (en) * 1986-01-28 1987-08-08
JPS6431443A (en) * 1987-07-27 1989-02-01 Nec Corp Semiconductor device
JPH05243428A (en) * 1991-12-20 1993-09-21 Toshiba Corp Electronic equipment
US10488201B2 (en) 2016-12-08 2019-11-26 Kabushiki Kaisha Toshiba Vibration device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107063A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor package
JPS57130454A (en) * 1981-02-06 1982-08-12 Nec Corp Chip carrier
US4556899A (en) * 1981-06-05 1985-12-03 Hitachi, Ltd. Insulated type semiconductor devices
JPS59134852A (en) * 1983-01-21 1984-08-02 Hitachi Ltd Integrated circuit package
JPH0117258B2 (en) * 1983-01-21 1989-03-29 Hitachi Ltd
JPS61147558A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor housing case
JPS62124855U (en) * 1986-01-28 1987-08-08
JPS6431443A (en) * 1987-07-27 1989-02-01 Nec Corp Semiconductor device
JPH05243428A (en) * 1991-12-20 1993-09-21 Toshiba Corp Electronic equipment
US10488201B2 (en) 2016-12-08 2019-11-26 Kabushiki Kaisha Toshiba Vibration device

Similar Documents

Publication Publication Date Title
JPS5389664A (en) Package structure of semiconductor device
JPS52113166A (en) Radiating fin for power transistor
JPS53126276A (en) Heat dissipation construction of multichip mounting substrate
JPS5225572A (en) Resin-seal type semiconductor device
JPS5314561A (en) Packaging device of semiconductor device
JPS5279775A (en) Semiconductor device
JPS52128063A (en) Manufacture of semiconductor device
JPS52147065A (en) Semiconductor device
JPS52128068A (en) Manufacture of cooling piece for semiconductor rectifying device
JPS5232140A (en) Heat absorbing device
JPS5267838A (en) High frequency heater
JPS5345973A (en) Resin-sealing-type semiconductor device
JPS53108281A (en) Manufacture of semiconductor device
JPS546464A (en) Semiconductor integrated-circuit device
JPS5418280A (en) Resin sealed semiconductor device
JPS542664A (en) Semiconductor device
JPS53113479A (en) Semiconductor device
JPS5274288A (en) Production of semiconductor device
JPS52125273A (en) Semiconductor device
JPS5438783A (en) Radiation electromotive force type battery
JPS53126275A (en) Semiconductor device
JPS5442986A (en) Menufacture of semiconductor device
JPS5286064A (en) Semiconductor device
JPS52136576A (en) Semiconductor device
JPS52141570A (en) Semiconductor device