JPS53126276A - Heat dissipation construction of multichip mounting substrate - Google Patents
Heat dissipation construction of multichip mounting substrateInfo
- Publication number
- JPS53126276A JPS53126276A JP4040077A JP4040077A JPS53126276A JP S53126276 A JPS53126276 A JP S53126276A JP 4040077 A JP4040077 A JP 4040077A JP 4040077 A JP4040077 A JP 4040077A JP S53126276 A JPS53126276 A JP S53126276A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- mounting substrate
- multichip mounting
- multichip
- dissipation construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve the heat dissipation efficiency of a multichip mounting substrate by providing metalstuds through a wiring substrate, providing a required IC chip to one end thereof and mounting a fin to the other end.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4040077A JPS53126276A (en) | 1977-04-11 | 1977-04-11 | Heat dissipation construction of multichip mounting substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4040077A JPS53126276A (en) | 1977-04-11 | 1977-04-11 | Heat dissipation construction of multichip mounting substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53126276A true JPS53126276A (en) | 1978-11-04 |
Family
ID=12579600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4040077A Pending JPS53126276A (en) | 1977-04-11 | 1977-04-11 | Heat dissipation construction of multichip mounting substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53126276A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562252U (en) * | 1979-06-20 | 1981-01-10 | ||
JPS567353U (en) * | 1979-06-27 | 1981-01-22 | ||
JPS567355U (en) * | 1979-06-27 | 1981-01-22 | ||
JPS569751U (en) * | 1979-06-29 | 1981-01-27 | ||
JPS569750U (en) * | 1979-06-29 | 1981-01-27 | ||
US4688077A (en) * | 1982-03-29 | 1987-08-18 | Fujitsu Limited | Semiconductor device having radiator |
JPH01120392U (en) * | 1988-02-10 | 1989-08-15 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619734A (en) * | 1969-12-17 | 1971-11-09 | Rca Corp | Assembly of series connected semiconductor elements having good heat dissipation |
-
1977
- 1977-04-11 JP JP4040077A patent/JPS53126276A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619734A (en) * | 1969-12-17 | 1971-11-09 | Rca Corp | Assembly of series connected semiconductor elements having good heat dissipation |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562252U (en) * | 1979-06-20 | 1981-01-10 | ||
JPS567353U (en) * | 1979-06-27 | 1981-01-22 | ||
JPS567355U (en) * | 1979-06-27 | 1981-01-22 | ||
JPS569751U (en) * | 1979-06-29 | 1981-01-27 | ||
JPS569750U (en) * | 1979-06-29 | 1981-01-27 | ||
US4688077A (en) * | 1982-03-29 | 1987-08-18 | Fujitsu Limited | Semiconductor device having radiator |
JPH01120392U (en) * | 1988-02-10 | 1989-08-15 |
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