JPS53126276A - Heat dissipation construction of multichip mounting substrate - Google Patents

Heat dissipation construction of multichip mounting substrate

Info

Publication number
JPS53126276A
JPS53126276A JP4040077A JP4040077A JPS53126276A JP S53126276 A JPS53126276 A JP S53126276A JP 4040077 A JP4040077 A JP 4040077A JP 4040077 A JP4040077 A JP 4040077A JP S53126276 A JPS53126276 A JP S53126276A
Authority
JP
Japan
Prior art keywords
heat dissipation
mounting substrate
multichip mounting
multichip
dissipation construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4040077A
Other languages
Japanese (ja)
Inventor
Etsuro Sasaki
Ken Ogiso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP4040077A priority Critical patent/JPS53126276A/en
Publication of JPS53126276A publication Critical patent/JPS53126276A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the heat dissipation efficiency of a multichip mounting substrate by providing metalstuds through a wiring substrate, providing a required IC chip to one end thereof and mounting a fin to the other end.
COPYRIGHT: (C)1978,JPO&Japio
JP4040077A 1977-04-11 1977-04-11 Heat dissipation construction of multichip mounting substrate Pending JPS53126276A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4040077A JPS53126276A (en) 1977-04-11 1977-04-11 Heat dissipation construction of multichip mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4040077A JPS53126276A (en) 1977-04-11 1977-04-11 Heat dissipation construction of multichip mounting substrate

Publications (1)

Publication Number Publication Date
JPS53126276A true JPS53126276A (en) 1978-11-04

Family

ID=12579600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4040077A Pending JPS53126276A (en) 1977-04-11 1977-04-11 Heat dissipation construction of multichip mounting substrate

Country Status (1)

Country Link
JP (1) JPS53126276A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562252U (en) * 1979-06-20 1981-01-10
JPS567353U (en) * 1979-06-27 1981-01-22
JPS567355U (en) * 1979-06-27 1981-01-22
JPS569751U (en) * 1979-06-29 1981-01-27
JPS569750U (en) * 1979-06-29 1981-01-27
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
JPH01120392U (en) * 1988-02-10 1989-08-15

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619734A (en) * 1969-12-17 1971-11-09 Rca Corp Assembly of series connected semiconductor elements having good heat dissipation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619734A (en) * 1969-12-17 1971-11-09 Rca Corp Assembly of series connected semiconductor elements having good heat dissipation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562252U (en) * 1979-06-20 1981-01-10
JPS567353U (en) * 1979-06-27 1981-01-22
JPS567355U (en) * 1979-06-27 1981-01-22
JPS569751U (en) * 1979-06-29 1981-01-27
JPS569750U (en) * 1979-06-29 1981-01-27
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
JPH01120392U (en) * 1988-02-10 1989-08-15

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