JPS52128068A - Manufacture of cooling piece for semiconductor rectifying device - Google Patents

Manufacture of cooling piece for semiconductor rectifying device

Info

Publication number
JPS52128068A
JPS52128068A JP4448876A JP4448876A JPS52128068A JP S52128068 A JPS52128068 A JP S52128068A JP 4448876 A JP4448876 A JP 4448876A JP 4448876 A JP4448876 A JP 4448876A JP S52128068 A JPS52128068 A JP S52128068A
Authority
JP
Japan
Prior art keywords
manufacture
cooling piece
rectifying device
semiconductor rectifying
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4448876A
Other languages
Japanese (ja)
Inventor
Katsutoshi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4448876A priority Critical patent/JPS52128068A/en
Publication of JPS52128068A publication Critical patent/JPS52128068A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain easily the cooling piece which can enhance the cooling performance by occuring turbulence of the cooling air.
COPYRIGHT: (C)1977,JPO&Japio
JP4448876A 1976-04-21 1976-04-21 Manufacture of cooling piece for semiconductor rectifying device Pending JPS52128068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4448876A JPS52128068A (en) 1976-04-21 1976-04-21 Manufacture of cooling piece for semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4448876A JPS52128068A (en) 1976-04-21 1976-04-21 Manufacture of cooling piece for semiconductor rectifying device

Publications (1)

Publication Number Publication Date
JPS52128068A true JPS52128068A (en) 1977-10-27

Family

ID=12692921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4448876A Pending JPS52128068A (en) 1976-04-21 1976-04-21 Manufacture of cooling piece for semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS52128068A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527679A (en) * 1978-08-18 1980-02-27 Nec Corp Self-cooled heat sink for semiconductor element
JP2005351488A (en) * 2004-06-08 2005-12-22 Kyasutemu:Kk Heat exchanging member, heat exchanger, heat exchanging unit and heat exchanging system
JP2008193007A (en) * 2007-02-07 2008-08-21 Sankyo Material Inc Heat sink made of aluminum extruded material
JP2009088056A (en) * 2007-09-28 2009-04-23 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527679A (en) * 1978-08-18 1980-02-27 Nec Corp Self-cooled heat sink for semiconductor element
JPS6148782B2 (en) * 1978-08-18 1986-10-25 Nippon Electric Co
JP2005351488A (en) * 2004-06-08 2005-12-22 Kyasutemu:Kk Heat exchanging member, heat exchanger, heat exchanging unit and heat exchanging system
JP2008193007A (en) * 2007-02-07 2008-08-21 Sankyo Material Inc Heat sink made of aluminum extruded material
JP2009088056A (en) * 2007-09-28 2009-04-23 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material

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