JPS6431443A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6431443A
JPS6431443A JP18817487A JP18817487A JPS6431443A JP S6431443 A JPS6431443 A JP S6431443A JP 18817487 A JP18817487 A JP 18817487A JP 18817487 A JP18817487 A JP 18817487A JP S6431443 A JPS6431443 A JP S6431443A
Authority
JP
Japan
Prior art keywords
chip
heat sink
leads
manufacturing cost
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18817487A
Other languages
Japanese (ja)
Inventor
Kenji Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18817487A priority Critical patent/JPS6431443A/en
Publication of JPS6431443A publication Critical patent/JPS6431443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To shorten a manufacturing process and to reduce a manufacturing cost by placing a semiconductor chip directly on a heat sink to remove the heat generated at the chip. CONSTITUTION:In a device, a semiconductor chip 2 is directly mounted on a heat sink 1 of aluminum with heat sink fins at the outside, a bonding pad on the chip is wired by bonding wirings 4 to the leads 3 of a lead frame bonded by an adhesive on the insulated sink 1, the chip 2 is covered with silicone resin 5 to protect the chip 2, and the leads 3 are so shaped as to be able to mount on the surface. Accordingly, the manufacturing steps can be shortened to largely reduce the manufacturing cost.
JP18817487A 1987-07-27 1987-07-27 Semiconductor device Pending JPS6431443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18817487A JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18817487A JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431443A true JPS6431443A (en) 1989-02-01

Family

ID=16219055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18817487A Pending JPS6431443A (en) 1987-07-27 1987-07-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431443A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
EP0777271A3 (en) * 1995-11-30 1999-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a lead frame and a heat sink
KR100235750B1 (en) * 1997-05-13 1999-12-15 김규현 Semiconductor package
KR100352116B1 (en) * 1996-12-06 2002-12-16 앰코 테크놀로지 코리아 주식회사 Structure of semiconductor package capable of easily radiating heat
US7381684B2 (en) 2001-10-16 2008-06-03 Lintec Corporation Method for using a rewritable thermal label

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS59117244A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS59117244A (en) * 1982-12-24 1984-07-06 Hitachi Tokyo Electronics Co Ltd Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
EP0777271A3 (en) * 1995-11-30 1999-07-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor device comprising a lead frame and a heat sink
KR100352116B1 (en) * 1996-12-06 2002-12-16 앰코 테크놀로지 코리아 주식회사 Structure of semiconductor package capable of easily radiating heat
KR100235750B1 (en) * 1997-05-13 1999-12-15 김규현 Semiconductor package
US7381684B2 (en) 2001-10-16 2008-06-03 Lintec Corporation Method for using a rewritable thermal label

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