JPS5629352A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5629352A
JPS5629352A JP10464679A JP10464679A JPS5629352A JP S5629352 A JPS5629352 A JP S5629352A JP 10464679 A JP10464679 A JP 10464679A JP 10464679 A JP10464679 A JP 10464679A JP S5629352 A JPS5629352 A JP S5629352A
Authority
JP
Japan
Prior art keywords
resin
lead frame
wire
semiconductor device
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10464679A
Other languages
Japanese (ja)
Inventor
Eigo Fuse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10464679A priority Critical patent/JPS5629352A/en
Publication of JPS5629352A publication Critical patent/JPS5629352A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To prevent deformation of a lead frame of a resin-sealed semiconductor device at the time of reducing thermal resistance thereof and sealing resin therewith by connecting the semiconductor element carriage of the lead frame to the lead unit through a heat dissipating insulating plate. CONSTITUTION:A semiconductor element 3 is placed on an island 2 of a lead frame, and is connected to an external lead wire 4 through a wire 5. The island 2 is connected through the wire 4 to a thermally conductive ceramic substrate 6, and is sealed with resin 1. Since this configuration dissipates preferably the heat of the element 3 and makes a part of the frame 4 contact with the ceramic substrate 6, the lead frame may not be deformed at the time of sealing it with resin.
JP10464679A 1979-08-17 1979-08-17 Resin-sealed semiconductor device Pending JPS5629352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10464679A JPS5629352A (en) 1979-08-17 1979-08-17 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10464679A JPS5629352A (en) 1979-08-17 1979-08-17 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5629352A true JPS5629352A (en) 1981-03-24

Family

ID=14386216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10464679A Pending JPS5629352A (en) 1979-08-17 1979-08-17 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5629352A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175753A (en) * 1983-03-25 1984-10-04 Toshiba Corp Semiconductor device and lead frame
JPS60163770U (en) * 1984-04-09 1985-10-30 カシオ計算機株式会社 circuit board
JPS63166926A (en) * 1986-12-26 1988-07-11 Toshiba Corp Production of metallic material
WO1994014194A1 (en) * 1992-12-17 1994-06-23 Vlsi Technology, Inc. Void-free thermally enhanced plastic package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225572A (en) * 1975-08-22 1977-02-25 Hitachi Ltd Resin-seal type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225572A (en) * 1975-08-22 1977-02-25 Hitachi Ltd Resin-seal type semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175753A (en) * 1983-03-25 1984-10-04 Toshiba Corp Semiconductor device and lead frame
JPS60163770U (en) * 1984-04-09 1985-10-30 カシオ計算機株式会社 circuit board
JPS63166926A (en) * 1986-12-26 1988-07-11 Toshiba Corp Production of metallic material
WO1994014194A1 (en) * 1992-12-17 1994-06-23 Vlsi Technology, Inc. Void-free thermally enhanced plastic package

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