JPS56146263A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56146263A
JPS56146263A JP4983380A JP4983380A JPS56146263A JP S56146263 A JPS56146263 A JP S56146263A JP 4983380 A JP4983380 A JP 4983380A JP 4983380 A JP4983380 A JP 4983380A JP S56146263 A JPS56146263 A JP S56146263A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
resin
frame
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4983380A
Other languages
Japanese (ja)
Other versions
JPS6050346B2 (en
Inventor
Kazuo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55049833A priority Critical patent/JPS6050346B2/en
Publication of JPS56146263A publication Critical patent/JPS56146263A/en
Publication of JPS6050346B2 publication Critical patent/JPS6050346B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To manufacture easily the semiconductor device sealed with a resin and having heat sink in mass production by a method wherein on the back face of a series of lead frame being put on with semiconductor element, a series of heat sink frame having heat sink inside the frame body is piled up and is sealed with a resin. CONSTITUTION:The heat sink frame is consisted of a frame body part 43, a heat sink part 41 and supported parts 42, and is formed of a copper plate, an Al plate, etc., by press and is covered with an electrically insulating polyimide. A series of heat slink frame thereof having the heat sinks inside the frame body is piled up on the back face of a series of lead frame being equipped with semiconductor device and is sealed with the resin. Then the heat sink frame body part 56 is removed from the semiconductor device being sealed with the resin. Accordingly the semiconductor device sealed with the resin and having the heat sink can be manufactured easily in mass production.
JP55049833A 1980-04-16 1980-04-16 Manufacturing method of semiconductor device Expired JPS6050346B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55049833A JPS6050346B2 (en) 1980-04-16 1980-04-16 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55049833A JPS6050346B2 (en) 1980-04-16 1980-04-16 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56146263A true JPS56146263A (en) 1981-11-13
JPS6050346B2 JPS6050346B2 (en) 1985-11-08

Family

ID=12842076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55049833A Expired JPS6050346B2 (en) 1980-04-16 1980-04-16 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6050346B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895654U (en) * 1981-12-23 1983-06-29 日本電気株式会社 Package for power integrated circuits
EP0104231A1 (en) * 1982-04-05 1984-04-04 Motorola, Inc. A self-positioning heat spreader
JPH01270336A (en) * 1988-04-22 1989-10-27 Hitachi Ltd Manufacture of semicondcutor device
JPH03222464A (en) * 1990-01-29 1991-10-01 Mitsubishi Electric Corp Semiconductor device and its manufacture
EP0767495A3 (en) * 1991-06-17 1997-05-21 Fujitsu Limited Surface-mounting type semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895654U (en) * 1981-12-23 1983-06-29 日本電気株式会社 Package for power integrated circuits
JPS6334284Y2 (en) * 1981-12-23 1988-09-12
EP0104231A1 (en) * 1982-04-05 1984-04-04 Motorola, Inc. A self-positioning heat spreader
EP0104231A4 (en) * 1982-04-05 1985-10-30 Motorola Inc A self-positioning heat spreader.
JPH01270336A (en) * 1988-04-22 1989-10-27 Hitachi Ltd Manufacture of semicondcutor device
JPH03222464A (en) * 1990-01-29 1991-10-01 Mitsubishi Electric Corp Semiconductor device and its manufacture
EP0767495A3 (en) * 1991-06-17 1997-05-21 Fujitsu Limited Surface-mounting type semiconductor device

Also Published As

Publication number Publication date
JPS6050346B2 (en) 1985-11-08

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