JPS5322365A - Resin mold type semiconductor device and its production - Google Patents

Resin mold type semiconductor device and its production

Info

Publication number
JPS5322365A
JPS5322365A JP9681876A JP9681876A JPS5322365A JP S5322365 A JPS5322365 A JP S5322365A JP 9681876 A JP9681876 A JP 9681876A JP 9681876 A JP9681876 A JP 9681876A JP S5322365 A JPS5322365 A JP S5322365A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
type semiconductor
resin mold
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9681876A
Other languages
Japanese (ja)
Other versions
JPS5643658B2 (en
Inventor
Masatami Miura
Shuroku Sakurada
Toshitaka Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9681876A priority Critical patent/JPS5322365A/en
Publication of JPS5322365A publication Critical patent/JPS5322365A/en
Publication of JPS5643658B2 publication Critical patent/JPS5643658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:Deformations of tabs and leads are eliminated and further solderability of leads is improved by plating a Ni layer which is strong to heating treatment to copper tab portions and depositing a solder layer on the copper lead portions by a dipping method.
JP9681876A 1976-08-13 1976-08-13 Resin mold type semiconductor device and its production Granted JPS5322365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9681876A JPS5322365A (en) 1976-08-13 1976-08-13 Resin mold type semiconductor device and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9681876A JPS5322365A (en) 1976-08-13 1976-08-13 Resin mold type semiconductor device and its production

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57123842A Division JPS5882543A (en) 1982-07-15 1982-07-15 Resin mold type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5322365A true JPS5322365A (en) 1978-03-01
JPS5643658B2 JPS5643658B2 (en) 1981-10-14

Family

ID=14175152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9681876A Granted JPS5322365A (en) 1976-08-13 1976-08-13 Resin mold type semiconductor device and its production

Country Status (1)

Country Link
JP (1) JPS5322365A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378607A (en) * 1976-12-23 1978-07-12 Mitsubishi Heavy Ind Ltd Internal combustion type vibratory pile driver
JPS5380706A (en) * 1976-12-24 1978-07-17 Mitsubishi Heavy Ind Ltd Vibratory pile driver
JPS5718330A (en) * 1980-07-10 1982-01-30 Toshiba Corp Method of and apparatus for soldering semiconductor device
JPS5987152U (en) * 1982-11-30 1984-06-13 三菱電機株式会社 Frame for semiconductor devices
JPS63122254A (en) * 1986-11-12 1988-05-26 Hitachi Cable Ltd Manufacture of lead frame for semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513742U (en) * 1974-06-25 1976-01-12
JPS5117383A (en) * 1974-08-05 1976-02-12 Asahi Chemical Ind
JPS5143078A (en) * 1974-10-09 1976-04-13 Nippon Electric Co HANDOTA ISOCHI
JPS5162668A (en) * 1974-11-27 1976-05-31 New Nippon Electric Co MOORUDOGATAHANDOTAISOCHINO SEIZOHOHO

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513742U (en) * 1974-06-25 1976-01-12
JPS5117383A (en) * 1974-08-05 1976-02-12 Asahi Chemical Ind
JPS5143078A (en) * 1974-10-09 1976-04-13 Nippon Electric Co HANDOTA ISOCHI
JPS5162668A (en) * 1974-11-27 1976-05-31 New Nippon Electric Co MOORUDOGATAHANDOTAISOCHINO SEIZOHOHO

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378607A (en) * 1976-12-23 1978-07-12 Mitsubishi Heavy Ind Ltd Internal combustion type vibratory pile driver
JPS5380706A (en) * 1976-12-24 1978-07-17 Mitsubishi Heavy Ind Ltd Vibratory pile driver
JPS5825134B2 (en) * 1976-12-24 1983-05-25 三菱重工業株式会社 vibrating pile driver
JPS5718330A (en) * 1980-07-10 1982-01-30 Toshiba Corp Method of and apparatus for soldering semiconductor device
JPH0130302B2 (en) * 1980-07-10 1989-06-19 Tokyo Shibaura Electric Co
JPS5987152U (en) * 1982-11-30 1984-06-13 三菱電機株式会社 Frame for semiconductor devices
JPS63122254A (en) * 1986-11-12 1988-05-26 Hitachi Cable Ltd Manufacture of lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS5643658B2 (en) 1981-10-14

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