JPS5372570A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5372570A JPS5372570A JP14888876A JP14888876A JPS5372570A JP S5372570 A JPS5372570 A JP S5372570A JP 14888876 A JP14888876 A JP 14888876A JP 14888876 A JP14888876 A JP 14888876A JP S5372570 A JPS5372570 A JP S5372570A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- coating
- resin
- short circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent the short circuit for the internal lead wire and to increase the anti-moisture performance by having a plastic molding after coating the resin on the entire surface of the half-finished device before molding.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14888876A JPS5372570A (en) | 1976-12-10 | 1976-12-10 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14888876A JPS5372570A (en) | 1976-12-10 | 1976-12-10 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5372570A true JPS5372570A (en) | 1978-06-28 |
Family
ID=15462937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14888876A Pending JPS5372570A (en) | 1976-12-10 | 1976-12-10 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5372570A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627941A (en) * | 1979-08-17 | 1981-03-18 | Hitachi Ltd | Manufacture of semiconductor device |
JPS5850759A (en) * | 1981-09-21 | 1983-03-25 | Nec Corp | Resin enclosed semiconductor device |
JPS60208846A (en) * | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | Heat resisting plastic ic |
JPS61148824A (en) * | 1984-12-21 | 1986-07-07 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1976
- 1976-12-10 JP JP14888876A patent/JPS5372570A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627941A (en) * | 1979-08-17 | 1981-03-18 | Hitachi Ltd | Manufacture of semiconductor device |
JPS5850759A (en) * | 1981-09-21 | 1983-03-25 | Nec Corp | Resin enclosed semiconductor device |
JPS60208846A (en) * | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | Heat resisting plastic ic |
JPS61148824A (en) * | 1984-12-21 | 1986-07-07 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5372570A (en) | Manufacture of semiconductor device | |
JPS534472A (en) | Semiconductor package | |
JPS53299A (en) | Epoxy resin composition | |
JPS5345978A (en) | Insulated-gate-protective semiconductor device | |
JPS5231673A (en) | Resin sealing method of semiconductor device | |
JPS52172A (en) | Semiconductor | |
JPS5379469A (en) | Manufacture of glass mold type semiconductor rectifying device | |
JPS5223273A (en) | Method of manufacturing semiconductor element | |
JPS52102675A (en) | Insulating tape and preparation of semiconductor device using the same same | |
JPS5366172A (en) | Resin mold element | |
JPS52156561A (en) | Resin molded semiconductor device and its production | |
JPS5237954A (en) | Semiconductor resin composition with improved releasability | |
JPS5240067A (en) | Resin molded type semiconductor device | |
JPS5338979A (en) | Manufacture of resin mold type semiconductor device | |
JPS51134793A (en) | Method for manufacturing a cured epoxy resin | |
JPS542667A (en) | Manufacture of semiconductor device | |
JPS5280780A (en) | Semiconductor device | |
JPS5380970A (en) | Manufacture of resin shield type semiconductor device | |
JPS526083A (en) | Production method of semiconductor device | |
JPS5345174A (en) | Moisture resistant semiconductor device | |
JPS5313874A (en) | Production of semiconductor device | |
JPS52117067A (en) | Semiconductor device | |
JPS523177A (en) | Method of manufacturing resin coated electric wires | |
JPS5325363A (en) | Semiconductor element | |
JPS5235899A (en) | Manufacturing method of thermo-settig resin electroet |