JPS5240067A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS5240067A
JPS5240067A JP11561475A JP11561475A JPS5240067A JP S5240067 A JPS5240067 A JP S5240067A JP 11561475 A JP11561475 A JP 11561475A JP 11561475 A JP11561475 A JP 11561475A JP S5240067 A JPS5240067 A JP S5240067A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
resin molded
molded type
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11561475A
Other languages
Japanese (ja)
Inventor
Eiichi Yamada
Akira Suzuki
Tokio Kato
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11561475A priority Critical patent/JPS5240067A/en
Publication of JPS5240067A publication Critical patent/JPS5240067A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A resin molded type semiconductor device which does not cause corrosion of electrodes and wiring layers is obtained.
COPYRIGHT: (C)1977,JPO&Japio
JP11561475A 1975-09-26 1975-09-26 Resin molded type semiconductor device Pending JPS5240067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11561475A JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11561475A JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5240067A true JPS5240067A (en) 1977-03-28

Family

ID=14667000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11561475A Pending JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5240067A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress

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