JPS5718330A - Method of and apparatus for soldering semiconductor device - Google Patents
Method of and apparatus for soldering semiconductor deviceInfo
- Publication number
- JPS5718330A JPS5718330A JP9325580A JP9325580A JPS5718330A JP S5718330 A JPS5718330 A JP S5718330A JP 9325580 A JP9325580 A JP 9325580A JP 9325580 A JP9325580 A JP 9325580A JP S5718330 A JPS5718330 A JP S5718330A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- semiconductor devices
- leaving
- bending
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Abstract
PURPOSE:To facilitate continuous automation of a plurality of semiconductor devices through etching, flux coating and soldering of the terminals thereof by employing a lead frame for supporting the semiconductor devices with the cutting and bending of the terminals thereof leaving the connection to a hanging pin. CONSTITUTION:A lead frame 4 which supports a resin-sealed semiconductor device 1 with the cutting and bending of the terminals thereof leaving a connection to hanging pin 5 is placed on a guide rail and conveyed along the rail. In the course, the terminals of the device are etched, washed and soldered. Including the washing and drying of the semiconductor devices, the full operation of all processes is done automatically and continuously. This can save time and labor for the aligning work of the semiconductor devices thereby improving the production efficiency while enabling automation connected to other processes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9325580A JPS5718330A (en) | 1980-07-10 | 1980-07-10 | Method of and apparatus for soldering semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9325580A JPS5718330A (en) | 1980-07-10 | 1980-07-10 | Method of and apparatus for soldering semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5718330A true JPS5718330A (en) | 1982-01-30 |
JPH0130302B2 JPH0130302B2 (en) | 1989-06-19 |
Family
ID=14077385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9325580A Granted JPS5718330A (en) | 1980-07-10 | 1980-07-10 | Method of and apparatus for soldering semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5718330A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
JPS58158993A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Method and device for soldering electronic part |
JPH02172838A (en) * | 1988-12-23 | 1990-07-04 | Shin Etsu Chem Co Ltd | Production of optical fiber preform |
JPH04162555A (en) * | 1990-10-25 | 1992-06-08 | Mitsubishi Materials Corp | Lead frame and its manufacturing and semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039063A (en) * | 1973-08-08 | 1975-04-10 | ||
JPS5065173A (en) * | 1973-10-09 | 1975-06-02 | ||
JPS5322365A (en) * | 1976-08-13 | 1978-03-01 | Hitachi Ltd | Resin mold type semiconductor device and its production |
JPS5439228A (en) * | 1977-09-02 | 1979-03-26 | Hitachi Ltd | Evaporation type combustion device |
-
1980
- 1980-07-10 JP JP9325580A patent/JPS5718330A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039063A (en) * | 1973-08-08 | 1975-04-10 | ||
JPS5065173A (en) * | 1973-10-09 | 1975-06-02 | ||
JPS5322365A (en) * | 1976-08-13 | 1978-03-01 | Hitachi Ltd | Resin mold type semiconductor device and its production |
JPS5439228A (en) * | 1977-09-02 | 1979-03-26 | Hitachi Ltd | Evaporation type combustion device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
JPS58158993A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Method and device for soldering electronic part |
JPH02172838A (en) * | 1988-12-23 | 1990-07-04 | Shin Etsu Chem Co Ltd | Production of optical fiber preform |
JPH04162555A (en) * | 1990-10-25 | 1992-06-08 | Mitsubishi Materials Corp | Lead frame and its manufacturing and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0130302B2 (en) | 1989-06-19 |
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