JPS5763836A - Die bonding apparatus - Google Patents

Die bonding apparatus

Info

Publication number
JPS5763836A
JPS5763836A JP13905280A JP13905280A JPS5763836A JP S5763836 A JPS5763836 A JP S5763836A JP 13905280 A JP13905280 A JP 13905280A JP 13905280 A JP13905280 A JP 13905280A JP S5763836 A JPS5763836 A JP S5763836A
Authority
JP
Japan
Prior art keywords
die
substrate
bonding
die bonding
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13905280A
Other languages
Japanese (ja)
Inventor
Kazuhiro Hayakawa
Minoru Kawagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP13905280A priority Critical patent/JPS5763836A/en
Publication of JPS5763836A publication Critical patent/JPS5763836A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To reduce the number of devices and to enhance working efficiency by performing preforming of a plurality of points on substrates which are intermittently transferred at a constant pitch, then performing die bonding on said points. CONSTITUTION:An XY table 10 is moved in a preform station 15, and the preform is performed at points 1a, 1b, and 1c on the substrate l. Said substrate 1 is moved to a die bonding station 25. An XY table 20 is moved, an arm 24 sucks a die A on a die supplying part 3, and bonding is performed at a die bonding point 1a on the substrate 1. This procedure is sequentially performed. In this constitution, since a plurality of the preformings can be performed on one substrate by one preform head and plurality of the die bondings can be performed by one bonding head, the number of the devices is reduced and the working efficiency can be enhanced.
JP13905280A 1980-10-04 1980-10-04 Die bonding apparatus Pending JPS5763836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13905280A JPS5763836A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13905280A JPS5763836A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5763836A true JPS5763836A (en) 1982-04-17

Family

ID=15236347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13905280A Pending JPS5763836A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5763836A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105328A (en) * 1982-12-09 1984-06-18 Nec Corp Feeder for solder material for die bonder
JPS5999439U (en) * 1982-12-23 1984-07-05 日本電気ホームエレクトロニクス株式会社 Pellet mounter for hybrid IC
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPS60117740A (en) * 1983-11-30 1985-06-25 Fuji Xerox Co Ltd Method for die bonding in hybrid integrated circuit
JPS60262432A (en) * 1984-06-11 1985-12-25 Toshiba Corp Mounting system
JPS6122637A (en) * 1984-07-11 1986-01-31 Toshiba Corp Bonding device
JPS6129134A (en) * 1984-07-19 1986-02-10 Toshiba Corp Mounting apparatus
JPS6151936A (en) * 1984-08-22 1986-03-14 Toshiba Corp Automatic mounting method for chip component
JPH01100437U (en) * 1987-12-22 1989-07-05
JPH02146832U (en) * 1990-05-10 1990-12-13
US5007162A (en) * 1989-01-06 1991-04-16 U.S. Philips Corporation Method and device for placing components on a support
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
US5232143A (en) * 1991-07-19 1993-08-03 Motorola, Inc. Multi-chip die bonder
US5579985A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
WO2005012144A1 (en) * 2003-07-30 2005-02-10 Nec Machinery Corporation Work carrying equipment and die bonder using the equipment

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0223025B2 (en) * 1982-12-09 1990-05-22 Nippon Electric Co
JPS59105328A (en) * 1982-12-09 1984-06-18 Nec Corp Feeder for solder material for die bonder
JPS5999439U (en) * 1982-12-23 1984-07-05 日本電気ホームエレクトロニクス株式会社 Pellet mounter for hybrid IC
JPH0356048Y2 (en) * 1982-12-23 1991-12-16
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPH04384B2 (en) * 1983-05-14 1992-01-07 Matsushita Electric Ind Co Ltd
JPH0230184B2 (en) * 1983-11-30 1990-07-04 Fuji Xerox Co Ltd
JPS60117740A (en) * 1983-11-30 1985-06-25 Fuji Xerox Co Ltd Method for die bonding in hybrid integrated circuit
JPS60262432A (en) * 1984-06-11 1985-12-25 Toshiba Corp Mounting system
JPS6122637A (en) * 1984-07-11 1986-01-31 Toshiba Corp Bonding device
JPS6129134A (en) * 1984-07-19 1986-02-10 Toshiba Corp Mounting apparatus
JPS6151936A (en) * 1984-08-22 1986-03-14 Toshiba Corp Automatic mounting method for chip component
JPH01100437U (en) * 1987-12-22 1989-07-05
US5007162A (en) * 1989-01-06 1991-04-16 U.S. Philips Corporation Method and device for placing components on a support
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
JPH02146832U (en) * 1990-05-10 1990-12-13
US5232143A (en) * 1991-07-19 1993-08-03 Motorola, Inc. Multi-chip die bonder
US5579985A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
US5579980A (en) * 1993-07-26 1996-12-03 Kabushiki Kaisha Shinkawa Chip bonding method and apparatus
WO2005012144A1 (en) * 2003-07-30 2005-02-10 Nec Machinery Corporation Work carrying equipment and die bonder using the equipment

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