JPS5763835A - Die bonding apparatus - Google Patents

Die bonding apparatus

Info

Publication number
JPS5763835A
JPS5763835A JP13905180A JP13905180A JPS5763835A JP S5763835 A JPS5763835 A JP S5763835A JP 13905180 A JP13905180 A JP 13905180A JP 13905180 A JP13905180 A JP 13905180A JP S5763835 A JPS5763835 A JP S5763835A
Authority
JP
Japan
Prior art keywords
bonding
die
substrate
preform
same time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13905180A
Other languages
Japanese (ja)
Inventor
Kazuhiro Hayakawa
Minoru Kawagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP13905180A priority Critical patent/JPS5763835A/en
Publication of JPS5763835A publication Critical patent/JPS5763835A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enhance working efficiency by performing a preform process for one of two parallel substrates which are intermittently transferred at a constant pitch, performing a die bonding process for the other, thereby performing the preforming and the die bonding at the same time. CONSTITUTION:The new substrate 1 is placed on a preform station 17. The substrate 1', wherein bonding agent is attached to 1a, lb, and 1c at the preform station 17, is placed on a bonding station 18. An XY table is moved, and an arm 16 sucks a die A on a die supplying part 3, and bonding is performed to the bonding point 1a of the substrate 1'. At the same time, an arm 14 of a preform head 13 preforms the bonding agent to a bonding point 1a of the substrate 1. The bonding is likewise performed to the points 1b and 1c, and the substrates are moved on a rail 2 at the constant pitch. Thus preforming and the die bonding are performed at the same time.
JP13905180A 1980-10-04 1980-10-04 Die bonding apparatus Pending JPS5763835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13905180A JPS5763835A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13905180A JPS5763835A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5763835A true JPS5763835A (en) 1982-04-17

Family

ID=15236322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13905180A Pending JPS5763835A (en) 1980-10-04 1980-10-04 Die bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5763835A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213036A (en) * 1984-04-09 1985-10-25 Shinkawa Ltd Chip bonding device
JPS60227428A (en) * 1984-04-26 1985-11-12 Shinkawa Ltd Chip bonding device
US5007162A (en) * 1989-01-06 1991-04-16 U.S. Philips Corporation Method and device for placing components on a support
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
FR2672428A1 (en) * 1991-02-04 1992-08-07 Schiltz Andre METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY SIZING HEAD.
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine
US5884831A (en) * 1996-07-05 1999-03-23 Ultex Corporation Ultrasonic vibration bonding chip mounter

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213036A (en) * 1984-04-09 1985-10-25 Shinkawa Ltd Chip bonding device
JPH055173B2 (en) * 1984-04-09 1993-01-21 Shinkawa Kk
JPS60227428A (en) * 1984-04-26 1985-11-12 Shinkawa Ltd Chip bonding device
JPH0548618B2 (en) * 1984-04-26 1993-07-22 Shinkawa Kk
US5007162A (en) * 1989-01-06 1991-04-16 U.S. Philips Corporation Method and device for placing components on a support
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
FR2672428A1 (en) * 1991-02-04 1992-08-07 Schiltz Andre METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY SIZING HEAD.
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine
US5884831A (en) * 1996-07-05 1999-03-23 Ultex Corporation Ultrasonic vibration bonding chip mounter

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