JPS60227428A - Chip bonding device - Google Patents

Abstract

PURPOSE:To perform coating of adhesive and bonding with one device by providing a guide rail on a base, intermittently transferring semiconductor substrates at fixed intervals in the base, and treating the substrates with a dispenser arm and a bonding arm extended from an X-Y table while the substrates are at a standstill. CONSTITUTION:On a base is provided a guide rail 4 in which semiconductor substrates 3A-3C are contained at fixed intervlals and intermittently transferred. On one side of the rail 4 is disposed an X-Y table 12 having a driving motor 10 in the X direction and a driving motor 11 in the X-Y direction, on which a rotary shaft supporting plate 14 driven by a motor 15 is mounted. From this rotary shaft 13, a dispenser arm 16 and a bonding arm 17 are protruded in parallel with each other. With such an arangement, the substrates 3A-3C are coated with adhesive by the dispenser arm and subjected to a fixed bonding using the bonding arm 17 while they are at a standstill.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a chip bonding apparatus 4.

(Background of the Invention) In chip bonding, an adhesive such as an epoxy resin is applied in advance to the location where the chip is to be bonded, and then the chip is bonded to the adhesive application location in a return stage.

Generally, in a typical IC, I, SI, etc., the chip is simply bonded to the substrate, so adhesive needs to be applied only at one central location where the chip is bonded. In such cases, the dispenser that drips the adhesive and the chip collet that bonds the chips are
Since they are always kept at a constant distance, by interlocking the dispenser arm that holds the dispenser and the bonding arm that holds the 1000-tube collet, adhesive application and chip bonding can be performed simultaneously with one device.

However, in the case of hybrid ICs in which chips such as resistors, capacitors, transistors, etc. are bonded, the adhesive must be applied to multiple locations at a predetermined distance from the center where the chips are bonded. To be more specific, the resistor chip and code/de/sub have electrodes on both ends of the chip, and it is necessary to apply adhesive to one chip at two locations corresponding to the electrodes. Also, since the transistor chip has three electrodes, one
It is necessary to apply adhesive at three locations on each chip.

If it is necessary to apply adhesive to multiple locations on a single chip like this, the distance between the dispenser and the chip collet will change, so adhesive application and 1000-tube bonding can be done simultaneously with one device. I can't.

(Object of the invention) The object of the present invention is to
Apply adhesive cloth and chip bonding ink to multiple locations at the same time.
It is an object of the present invention to provide a chip bonding device that can perform this.

(Example of the invention) Hereinafter, the present invention will be explained with reference to illustrated embodiments.

Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
The right side view of the figure, FIG. 3 shows the adhesive application mechanism part, (a)
is a front view, (b) is a side view, and FIG. 4 is an enlarged sectional view of the chip pickup portion. A guide rail fixing base 2 is fixed on four parts of the base 1, and guide rails 4.4 for guiding the substrates 3A, 3B, 3C, . . . are fixed on the guide rail fixing base 2. Between the guide rails 4 and 4, a stopper 5 that is movable upward and a presser plate 6 that is movable vertically and in the X direction and presses the substrates 3A, 3B, 3C, etc. against the stopper 5 are spaced at a constant interval. It is arranged to maintain the

The above is a conventionally known structure. Also, substrates 3A and 3B.

3C... are intermittently fed along the guide rail 4.4 by known means (not shown).

On one side of the guide rail 4 on the base 1,
The direction drive motor 10 and the Y direction drive motor 11
An XY table 12 made of well-known xIt construction and driven in the Y direction is mounted. A rotary shaft support plate 14 that rotatably supports a rotary shaft 13 extending in the X direction is fixed on the XY table 12, and a rotary drive motor fixed to the rotary shaft support plate 14 is mounted on the rotary shaft 13. 15 output shafts are connected. Further, the rotating shaft 13 has substrates 3A and 3B.

A dispenser arm 16 and a bonding arm 17 are fixed from the advancing side of 3C....

The dispenser arm 161 is equipped with an XY table 24 consisting of an X table 21 driven in the X direction by an X direction drive motor 20 and a Y table 23 driven in the Y direction by a Y direction drive motor 22. The XY table support plate 25 is fixed at a temperature of 0.degree. C. via the fixing plate 18. Since the structure of the XY table 24 itself is well known, a detailed explanation of its structure will be omitted, but the dispenser arm 16
The provision of one XY table 24 is a novel structure. A dispenser support plate 26 is fixed to the upper number ζ of the XY table 24, and the tip of a dispenser 27 is written and fixed to the tip of the dispenser support plate 26 so as to be positioned above between the guide rails 4. A chip collet 28 for vacuum suctioning a chip, which will be described later, is fixed to the tip of the bonding arm 17 so as to be positioned above between the guide rails 4. Here, the coordinate relationship between the tip of the dispenser 27 and the tip of the tip collet 28 is such that they are spaced apart at the same pitch interval as the pitch of the stopper 5 in the X direction, and have the same coordinates in the Y direction. .

A chip supply device 30 is disposed on the other side of the guide rail 4 of the base 1. That is, a chip filling reel rotation motor 32 is fixed to a support plate 31 fixed on the base 1, and a chip filling tape reel 33 is detachably attached to the output shaft of the chip filling reel rotation motor 32. ing. A hoop-shaped tape 35 for storing good chips 34 is wound around the chip filling tape reel 33 . The tape 35, as shown in FIG.
It is composed of a chip filling tape 38 formed by bonding the lower surface of an auxiliary tape 36 with holes 36a for storing chips 34 formed at equal intervals and a main tape 37, and a cover tape 39 that covers the upper surface of the auxiliary tape 36. ing. Although only the side surface is shown in FIG. 2, a cover tape winding motor 40 is fixed above the chip filling reel rotation motor 32, and the output shaft of the cover tape winding motor 40 cover tape take-up reel 41
is attached removably.

A guide roller 42 for guiding the cover tape 39 is rotatably supported by the support plate 31 between the chip-filled tape reel 33 and the cover tape take-up reel 41. Further, between the chip filling tape reel 33 and the guide rail 4, two guide rollers 43 and 44 for horizontally guiding the chip filling tape 38 are rotatably supported by the support plate 31.

Next, the operation will be explained. As shown in FIG. 1, the chip 34 is already bonded to the substrate 3A, and the substrate 3B
A description will be given of a state in which adhesive has already been applied at points B and C at a predetermined distance from the center point A to which the chip 34 is bonded.

From the state shown in Figure 1, X and Y direction drive motor 10.11
is driven, the XY table 12 moves in the XY direction, and the lower end of the chip collet 28 picks up the chip 34 stored in the tape 35 wound around the chip filling tape reel 33 (between the guide rollers 43 and 44). located above. Next, the rotation drive motor 15 is driven to rotate the dispenser arm 16 and bonding arm 17 via the rotation shaft 13, and the dispenser 27 and tip collet 28 are lowered. As a result, the chip collet 28
the lower end of which touches the chip 34 housed in the tape 35,
Vacuum adsorption.

Next, the rotational drive motor 15 reverses and the C dispenser 2
7 and the tip collet 28 rise. As a result, the chip 34 is picked up from the tape 35 by the chip collet 28. Subsequently, the X and Y direction drive motors 10.11 are driven to move the CXY table 12 in the XY directions, and the chip 34 attracted to the chip collet 28 is placed above point A of the substrate 3B, and the lower end of the dispenser 27 is placed above the point A of the substrate 3B. They are respectively located above point A of the substrate 3C. Next, the rotation drive motor 15 rotates normally, and the °C dispenser 27 and tip collet 28 descend. As a result, the chip 34 that has been absorbed by the chip collet 28 is pressed and bonded to the adhesive applied to the point A of the substrate 3B. Simultaneously with the descent of the dispenser 27, or according to a predetermined program before the dispenser 27 is positioned above point A of the board 3C, the X and Y drive motors 20 and 22 are driven to slightly move the XY table 24. Dispenser 27
When it descends and approaches the board 3C, it approaches point B;
Glue is dripped onto the spot. Next, according to a predetermined program, the X and Y drive motors 20 and 22 are driven again, and the CXY table 24 moves slightly until it approaches the zero point.
Adhesive is dropped at point 0. As described above, the substrate 3B
Bonding of chip 34 to and B and 0 of substrate 3C
When the application of the adhesive to the point is completed, the rotation drive motor 15 is reversed, and the dispenser 27 and the tip collet 2 are rotated in the opposite direction.
8 rises.

Further, as described above, the chips 34 housed in the tape 35 wound around the chip filling tape reel 33 are picked up by the chip collet 28, and at the same time, the motor 32 for rotating the chip filling reel and the cover tape winding The motor 40 rotates a certain amount, and the next chip filling tape 3
The next chip 34 in 8 is sent to the pick-up position.

In addition, the cover tape 39 is connected to a cover tape take-up reel 41.
The chip 34 inside the tape 35 is exposed.

When bonding of the chip 34 to point A of the C substrate 3B and application of adhesive to points B and 0 of the substrate 3C are completed through the above series of operations, the stopper 5 is lowered and the presser plate 6 is In Fig. 1, it descends while moving slightly to the left.Then, the C1 board 3A.

3B, 3C, . . . are fed one pitch along the guide rail 4 by a well-known feeding means, and the stopper 5 is raised just before this feeding is completed. After that, the holding plate 6 rises and moves to the right in FIG.
C... is pressed against the stopper 5. As a result, the board 3
C is located below the chip collet 28, and the substrate 3D is located below the dispenser 27.

In this way, the dispenser 27 is disposed above the guide rail 4 on the substrate advancing side at a certain distance from the chip collet 28, and the dispenser arm 16 that holds the dispenser 27 is driven by the drive to which the bodding arm 17 is attached. Attached to the means, and only the dispenser 27
C through the XY table 24 so that it can move in the YY direction.
Since it is attached to the dispenser arm 16, it is possible to simultaneously apply adhesive to multiple points B and C and bond the chip 34 to one amplifier with one device.

In addition, on the above-mentioned implementation side, pick-amplify from the tape 35 with the chip collet 28, and directly attach the board 3A, 3B.
. . . However, a known chip positioning means is provided between the guide rail 4 and the guide roller 44, and the chip collet 28 is bonded from the tape 35.
Alternatively, the chip is picked up by a separately provided chip collet, placed on the chip positioning means to position the chip, and then the positioned chip is transferred to the chip collet 2.
8 may be adsorbed and bonded. This improves the bonding accuracy of the chip.

In addition, when storing the chip 34 on the tape 35, the chip 34
In addition to simply storing the chip 34, the main tape 37 may have a weak adhesive on the chip storage side, and the chip 34 may be stored with the chip 34 attached to the main tape 37. In this case, the cover tape 39 may or may not be provided, but since the chip collet 28 may not be able to easily pick up the chip 34, as shown in FIG. A known push-up needle 50 that moves up and down
It is necessary to provide a push-up needle 50 to push the chip 34 up from the bottom surface of the tape 37. The chip supply device 30 also provides a tape 35 in which chips 34 are stored.
However, it is also possible to use a mechanism that drives in the XY directions a wafer ring to which guised chips are attached or a tray in which chips from which only non-defective products have been selected are housed, in the same way as in the past.

(Effects of the Invention) As is clear from the above description, according to the present invention, adhesive application to a plurality of locations on a single chip C and chip bonding can be performed simultaneously with one device.

[Brief explanation of drawings]

Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
The right side view of the figure, FIG. 3 shows the adhesion mechanism part, 1a) is a front view, (b) is a side view, and FIG. 4 is an enlarged sectional view of the chip pickup portion. 3A, 3B...: Board, 4... Guide rail, 10
...X direction drive motor, 11...Y direction drive motor, 12...xyY table 13...rotation shaft, 14...rotation shaft support plate, 15...rotation drive motor, Evening, 16...Dispenser arm, 17...
Bonding arm, 20... Motor for driving in the X direction, 22... Motor for driving in the Y direction, 24... XY table, 26... Disvenosa support plate, 27...
Despe/su, 28...Chip Colette. Figure 1

Claims (1)

[Claims] A dispenser that applies adhesive to the board, and an XY dispenser that holds and drives this dispenser in the XY direction.
a table, a dispenser arm that holds the XY table for the dispenser, a chip collet that is disposed in the substrate advancing direction from the dispenser and that bonds the chip to the adhesive application location, a bonding arm that holds the chip collet, and the A chip bonding apparatus comprising a dispenser arm and a drive means for holding the bonding arm and driving both arms simultaneously in the vertical and XY directions.