JPS60137030A - Bonding method of semiconductor pellet - Google Patents
Bonding method of semiconductor pelletInfo
- Publication number
- JPS60137030A JPS60137030A JP59227677A JP22767784A JPS60137030A JP S60137030 A JPS60137030 A JP S60137030A JP 59227677 A JP59227677 A JP 59227677A JP 22767784 A JP22767784 A JP 22767784A JP S60137030 A JPS60137030 A JP S60137030A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- substrate
- silver paste
- bonding
- conductive epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、半導体ペレットを基板の所定位置に取り付け
る際の半導体ベレットボンディング方法にｌ１ＩＩする
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention is directed to a semiconductor pellet bonding method for attaching a semiconductor pellet to a predetermined position on a substrate.
［発明の技術的背景Ｊ
半導体ペレットを基板に取りイ］（）るに際し、従来は
前工程において、位置決めされた基板の所定位置に導電
性エポキシ銀ペースＩ−を付着させ、導電性」−ボキシ
銀ペーストを付着させた基板をボンディング位置まで移
動させ、このボンディング位置にで再度基板を位置決め
し、この位置決めされた基板の所定位置にペレットを接
るさ「るという手段を講じていた。[Technical Background of the Invention J] When taking a semiconductor pellet onto a substrate, conventionally, in a pre-process, a conductive epoxy silver paste I- is attached to a predetermined position of the positioned substrate, and a conductive epoxy silver paste I- is attached to the substrate. The method used was to move the substrate to which the silver paste was attached to the bonding position, position the substrate again at this bonding position, and then attach the pellet to a predetermined position on the positioned substrate.
［背景技術の問題点］
ところが、前工程において導電性エポキシ銀ペーストを
基板の所定位置に正確に付着させることが困難であり、
更に導電性エポキシ銀ペースト位置にベレットを運ぶに
ついても位置規制が非常に困難である。この位置決めを
２度行なうということは誤差の発生が倍になることにな
り、大きな問題であった。[Problems with the Background Art] However, it is difficult to accurately attach the conductive epoxy silver paste to a predetermined position on the substrate in the pre-process.
Furthermore, it is very difficult to control the position of the pellet when transporting it to the location of the conductive epoxy silver paste. Performing this positioning twice doubles the error, which is a big problem.
又、導電性エポキシ銀ペーストを付着してからベレツ［
〜を付着するまで時間がかかるため、この間に導電性１
ボキシ銀ペーストが固まってしまい、半導体ペレットの
取り付けがうまくいかないといった欠点も有していた。Also, after applying conductive epoxy silver paste,
Because it takes time for ~ to adhere, conductive 1
Another disadvantage was that the boxy silver paste hardened, making it difficult to attach the semiconductor pellets.
［発明の目的］
本発明は前記の問題点を除去するために成されたもので
、基板への導電性エポキシ銀ベーストのイする並びに半
導体ペレッ］〜の取り付けを確実に行なうことのできる
半導体ペレットボンディング方法を捉供することを目的
とする。[Object of the Invention] The present invention has been made in order to eliminate the above-mentioned problems, and provides a semiconductor pellet that can reliably attach a conductive epoxy silver base to a substrate and attach the semiconductor pellet to the substrate. The purpose is to capture and provide information on bonding methods.
し発明の実施例１
本発明の実施に用いられる半導体ペレットボンディング
装置についての第１の実施例を第１図及び第２図に基き
詳細に説明する。時計方向と反時５１方向に回動自在に
支持される駆動軸１に、キー（図示省略）を介して昇降
管２を昇降自在に結合づることにより作動体を形成する
。なお図示省略の駆動装置により昇降管２は昇降及び回
動さμられる。この昇降管２には、先端にペレット３を
吸容保持１°る吸着コレット４を装着しＩこ保持アーム
５と、同じく吸着コレット４−を装着した保持アーム５
−とを角度θを持たせて固定する。又、一方の保持アー
ム５′の途中から保持アーム６を突出させ、この保持ア
ーム６の先端に導電性エボ４ニジ銀ペーストを所定量だ
けエアーによって吐出さけるようになっている公知の導
電性エポキシ銀ペースト供給機７を装着している。尚、
この導電性エポキシ銀ペースト供給機７はその中心と昇
降管２とを結ぶ位置が前記保持アーム５．５′とで形成
される角度θと同一の角度θをなし、回動中心から両コ
レット４．４−どの距離Ｑと同一の距離Ｑに位置してい
る。Embodiment 1 of the Invention A first embodiment of a semiconductor pellet bonding apparatus used for carrying out the present invention will be described in detail with reference to FIGS. 1 and 2. An actuating body is formed by connecting an elevator pipe 2 via a key (not shown) to a drive shaft 1 which is rotatably supported in clockwise and counterclockwise directions so as to be movable up and down. The elevator tube 2 is raised, lowered, and rotated by a drive device (not shown). This elevator tube 2 has a holding arm 5 equipped with a suction collet 4 that absorbs and holds pellets 3 at its tip, and a holding arm 5 that is also equipped with a suction collet 4-.
- and fixed at an angle θ. Further, a holding arm 6 is made to protrude from the middle of one holding arm 5', and a predetermined amount of conductive Evo 4 rainbow silver paste is discharged onto the tip of the holding arm 6 using air. A silver paste feeder 7 is installed. still,
This conductive epoxy silver paste feeder 7 has the same angle θ formed by the holding arm 5.5' with the position connecting its center and the elevator tube 2, and both collets 4 from the center of rotation. .4 - Which distance Q is located at the same distance Q?
尚、ペレット受台８は第２図に示すように支持台９に対
し、蟻結合１０．１０でＸ方向に移動できるように装着
し、支持台９は基台１１に蟻結合１２．１２にてＹ方向
に移動できるようになっている。このようなペレット受
台８上に複数種類のペレット３．３′を各々収納したペ
レット収納容器１３．１３−を乗架している。As shown in FIG. 2, the pellet holder 8 is attached to the support 9 so that it can move in the X direction with a dovetail connection 10.10, and the support 9 is attached to the base 11 with a dovetail connection 12.12. It is now possible to move in the Y direction. Pellet storage containers 13.13- each containing a plurality of types of pellets 3.3' are mounted on the pellet holder 8.
又、多梯類の形状の位置決めを行うことができる位置決
め装置１４は公知のものを使用するもので、位置決め基
台１５上に、中心に対して摺動できるように装着した複
数個のベレット挾持体１６、・・・にてペレット３．３
′の取り付（プ位置を定めるようになっている。Further, the positioning device 14 capable of positioning the shape of multiple ladders uses a known device, and includes a plurality of pellet clamps mounted on a positioning base 15 so as to be able to slide relative to the center. Pellets 3.3 at body 16,...
’ installation (to determine the position of the
又、ペレットボンディング台１７は、前記ペレット受台
８と同様にＸ方′向及びＹ方向に移動できるように構成
されているもので、説明は省略する。Further, the pellet bonding table 17 is configured to be movable in the X direction and the Y direction similarly to the pellet holder 8, and its explanation will be omitted.
そ１）′Ｃ基板１８を載置するようになっている。1) The 'C board 18 is placed thereon.
次に作動について説明する。第１図に示す位置において
、昇降管２を下降させ、吸着コレット４で収納容器１３
内のペレット３を吸着し、又、吸着コレラ］・４−で位
置決め装置１４上のペレット３を吸着覆る。更にペレッ
トボンディング受台１７、［にてボンディング位置に位
置決めされた基板１８の所定位置に導電性エポキシ銀ペ
ースト供給：器７から導電性エポキシ銀ペーストを何着
させる。Next, the operation will be explained. At the position shown in FIG. 1, the elevator pipe 2 is lowered, and the storage container 13 is
The pellet 3 on the positioning device 14 is suctioned and covered with the suction cholera]・4-. Further, conductive epoxy silver paste is supplied from the pellet bonding pedestal 17 to a predetermined position of the substrate 18 which is positioned at the bonding position.
次に昇降管２を上昇させ、駆動軸１を図において時計方
向へ回動させ、各々の保持アーム５．５−１６の位置を
変位させる。その後、昇降管２を再び下降させ、吸着コ
レット４−で吸着したペレツ１〜３を、基板１８の導電
性エポキシ銀ペースト上に押圧して付着させる。一方、
コレット４で吸着したペレット３は位置決め装置１４の
所定位置へ載置する。Next, the elevator tube 2 is raised and the drive shaft 1 is rotated clockwise in the figure to displace the position of each holding arm 5.5-16. Thereafter, the elevator tube 2 is lowered again, and the pellets 1 to 3 adsorbed by the adsorption collet 4- are pressed onto the conductive epoxy silver paste of the substrate 18 to adhere thereto. on the other hand,
The pellet 3 adsorbed by the collet 4 is placed at a predetermined position on the positioning device 14.
前記作業が終了すると、昇降管２は上昇し、駆動軸１は
反時計方向へ回動して元位置に戻る。各保持アーム５．
５′、６が元位置へ復帰リ−る運動中に、ペレットボン
ディング台１７はＸ、Ｙ方向に移動して基板１８の次の
ペレット付着６置をボンディング位置に定め、ペレット
受台８をｘ、Ｙ方向へ移動させて、次に供給するペレッ
ト３或いは３−を吸着コレット４の下方に位置させ、位
置決め装置１４にはペレットの供給位置を定める。When the above-mentioned work is completed, the elevator pipe 2 rises, and the drive shaft 1 rotates counterclockwise and returns to its original position. Each retaining arm5.
During the movement of 5' and 6 returning to their original positions, the pellet bonding table 17 moves in the X and Y directions to set the next pellet attachment position 6 on the substrate 18 at the bonding position, and the pellet holder 8 is moved to the x direction. , in the Y direction, the pellet 3 or 3- to be supplied next is positioned below the suction collet 4, and the positioning device 14 determines the pellet supply position.
次に、昇降管２を下降さμ、最初に説明したベレッ１−
の吸着及び導電性エポキシ銀ペースト付着作業を行なう
。Next, the elevator tube 2 is lowered μ, and the bellet 1-
adsorption and conductive epoxy silver paste deposition work.
尚、前記実施例においては、ペレット受台８上に複数個
のペレット収納容器１３．１３′、・・・を載置するよ
うに説明したが、使用づるペレッ１〜が１種類の場合は
−っでよいものである。In the above embodiment, it was explained that a plurality of pellet storage containers 13, 13', . It is a good thing.
又、ペレットボンディング台１７をＸ、Ｙ方向へ移動さ
せるように説明したが、ハイブリットにしたためで、基
板に１個だけベレッ１〜を付着さＶる際にはＸ、Ｙ方向
へ移動させる必要はないｂのである。Also, although the explanation was given to move the pellet bonding table 17 in the X and Y directions, since this is a hybrid, it is not necessary to move the pellet bonding table 17 in the X and Y directions when attaching only one pellet 1 to the substrate. There is no b.
次に、第２の実施例を第３図に基いてμ２明するど、導
電性Ｊボキシ銀ペースト供給機７を装着した保持アーム
６をＲ降着２に直接固定したもので、仙は全て第１の実
施例と同様なので同一符号をイリし、説明を省略する。Next, the second embodiment will be explained based on FIG. Since it is the same as the first embodiment, the same reference numerals will be omitted and the explanation will be omitted.
［発明の効果］
本発明はボンディング位置に位置決めされた基板に対し
、その基板上への導電性エポキシ銀ペーストの付着並び
に半導体ペレットの取りイリ【ノを行なうｊ、うにした
ので、導電性エポキシ銀ペーストのイ→着位向を確実に
定めることができ、導電性エポキシ銀ペースト（＝Ｊ
１位置へ確実に半導体ペレットを取り付１）ることがで
きる。[Effects of the Invention] The present invention attaches a conductive epoxy silver paste to a substrate positioned at a bonding position and removes a semiconductor pellet. It is possible to reliably determine the direction of the paste A→position, and conductive epoxy silver paste (=J
The semiconductor pellet can be reliably attached to one position (1).
図は本発明の実施に用いられる半導体ペレットボンディ
ング装置の実施例を示ずもので、第１図は第１の実施例
の平面図、第２図はペレット受台の縦断面図、第３図は
第２の実施例の要部のみを承り平面図である。
１・・・・駆動軸、２・・・昇降管、４．４′・・・吸
＠］レット、５．．５−１６・・・保持アーム、７・・
・導電性エポキシ銀ペースト供給機。
特許出願人 東芝精機株式会社The figures do not show an embodiment of the semiconductor pellet bonding apparatus used in carrying out the present invention, and FIG. 1 is a plan view of the first embodiment, FIG. 2 is a vertical cross-sectional view of a pellet holder, and FIG. FIG. 2 is a plan view showing only the main parts of the second embodiment. 1... Drive shaft, 2... Lifting pipe, 4.4'... Suction@]let, 5. ．． 5-16... Holding arm, 7...
・Conductive epoxy silver paste supply machine. Patent applicant: Toshiba Seiki Co., Ltd.
Claims (1)
介しＵｉｔ板の所定位］Ｈにボンディングする半導体ペ
レットボンディング方法において、導電性１ポキシ銀ベ
ーストの基板への付着は、ボンディング位置に位置決め
された基板に対して行なうことを特徴とする半導体ベレ
ットボンディング方法。(1) In a semiconductor pellet bonding method in which a semiconductor pellet is bonded to a conductive epoxy silver paste 1 at a predetermined position on a Uit board], the conductive epoxy silver paste 1 is attached to a substrate at a bonding position. A semiconductor bullet bonding method characterized in that it is performed on a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59227677A JPS60137030A (en) | 1981-12-04 | 1981-12-04 | Bonding method of semiconductor pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59227677A JPS60137030A (en) | 1981-12-04 | 1981-12-04 | Bonding method of semiconductor pellet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60137030A true JPS60137030A (en) | 1985-07-20 |
Family
ID=16864594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59227677A Pending JPS60137030A (en) | 1981-12-04 | 1981-12-04 | Bonding method of semiconductor pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60137030A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458358A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Pellet bonding method and its pellet bonder |
-
1981
- 1981-12-04 JP JP59227677A patent/JPS60137030A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458358A (en) * | 1977-10-19 | 1979-05-11 | Hitachi Ltd | Pellet bonding method and its pellet bonder |
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