JPS5458358A - Pellet bonding method and its pellet bonder - Google Patents

Pellet bonding method and its pellet bonder

Info

Publication number
JPS5458358A
JPS5458358A JP12451977A JP12451977A JPS5458358A JP S5458358 A JPS5458358 A JP S5458358A JP 12451977 A JP12451977 A JP 12451977A JP 12451977 A JP12451977 A JP 12451977A JP S5458358 A JPS5458358 A JP S5458358A
Authority
JP
Japan
Prior art keywords
pellet
substrate
resin
lifting
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12451977A
Other languages
Japanese (ja)
Other versions
JPS6036101B2 (en
Inventor
Kaoru Ito
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12451977A priority Critical patent/JPS6036101B2/en
Publication of JPS5458358A publication Critical patent/JPS5458358A/en
Publication of JPS6036101B2 publication Critical patent/JPS6036101B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To establish the bonding excellent in the electrical and thermal performance, by attaching the epoxy resin on the rear surface of pellet on the way of carrying the pellet on the substrate with collet and pressing the resin side on the substrate with carrying them on the substrate.
CONSTITUTION: After forwarding the collet 3, it is lowered and the pellet 1 on the containing tool 5 is absorbed with the absorbing section under the surface, and it is pushed down on a given amount of epoxy resin 2a placed on the table 8 under the fleet hole 14 with lifting up and down and retrogression. Thus, the resin film 2a is spread over the rear suface of the pellet 1, and the pellet 1 is pushed down on the substrate 4 on the table 8 with lifting up, retrogressing and lifting down. After that, the supply block is moved on the table 8, the wall 15 supplies new film 2a, and the substrate 4 is shifted by one pitch and this is repeated. Thus, a given amount of resin is attached on the rear side of the pellet 1 and the bonding strength is increased
COPYRIGHT: (C)1979,JPO&Japio
JP12451977A 1977-10-19 1977-10-19 pellet bonder Expired JPS6036101B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12451977A JPS6036101B2 (en) 1977-10-19 1977-10-19 pellet bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12451977A JPS6036101B2 (en) 1977-10-19 1977-10-19 pellet bonder

Publications (2)

Publication Number Publication Date
JPS5458358A true JPS5458358A (en) 1979-05-11
JPS6036101B2 JPS6036101B2 (en) 1985-08-19

Family

ID=14887480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12451977A Expired JPS6036101B2 (en) 1977-10-19 1977-10-19 pellet bonder

Country Status (1)

Country Link
JP (1) JPS6036101B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753949A (en) * 1980-09-17 1982-03-31 Nec Corp Mounting device of chip
JPS60137030A (en) * 1981-12-04 1985-07-20 Toshiba Seiki Kk Bonding method of semiconductor pellet
JPH01208836A (en) * 1988-02-17 1989-08-22 Hitachi Ltd Bonding method and device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753949A (en) * 1980-09-17 1982-03-31 Nec Corp Mounting device of chip
JPS6322061B2 (en) * 1980-09-17 1988-05-10 Nippon Electric Co
JPS60137030A (en) * 1981-12-04 1985-07-20 Toshiba Seiki Kk Bonding method of semiconductor pellet
JPH01208836A (en) * 1988-02-17 1989-08-22 Hitachi Ltd Bonding method and device

Also Published As

Publication number Publication date
JPS6036101B2 (en) 1985-08-19

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