JPS5468164A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5468164A
JPS5468164A JP13526777A JP13526777A JPS5468164A JP S5468164 A JPS5468164 A JP S5468164A JP 13526777 A JP13526777 A JP 13526777A JP 13526777 A JP13526777 A JP 13526777A JP S5468164 A JPS5468164 A JP S5468164A
Authority
JP
Japan
Prior art keywords
bonded
semiconductor device
film
copper foil
unevenness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13526777A
Other languages
Japanese (ja)
Inventor
Tetsuo Yabushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP13526777A priority Critical patent/JPS5468164A/en
Publication of JPS5468164A publication Critical patent/JPS5468164A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To use the space limited in the package with good efficiency.
CONSTITUTION: The copper foil 1 is bonded with film 3 by means of the adhesives 2, and to increase the bonding strength, the surface having greater unevenness of the copper foil 1 is bonded with the film 3. Further, the bump 4 of IC is bonded with gentle unevenness.
COPYRIGHT: (C)1979,JPO&Japio
JP13526777A 1977-11-11 1977-11-11 Semiconductor device Pending JPS5468164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13526777A JPS5468164A (en) 1977-11-11 1977-11-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13526777A JPS5468164A (en) 1977-11-11 1977-11-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5468164A true JPS5468164A (en) 1979-06-01

Family

ID=15147695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13526777A Pending JPS5468164A (en) 1977-11-11 1977-11-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5468164A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102040U (en) * 1984-12-10 1986-06-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102040U (en) * 1984-12-10 1986-06-28

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