JPS51112177A - Semiconductor equipment - Google Patents

Semiconductor equipment

Info

Publication number
JPS51112177A
JPS51112177A JP50037090A JP3709075A JPS51112177A JP S51112177 A JPS51112177 A JP S51112177A JP 50037090 A JP50037090 A JP 50037090A JP 3709075 A JP3709075 A JP 3709075A JP S51112177 A JPS51112177 A JP S51112177A
Authority
JP
Japan
Prior art keywords
semiconductor equipment
board
radiation
semiconductor
deciding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50037090A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50037090A priority Critical patent/JPS51112177A/en
Publication of JPS51112177A publication Critical patent/JPS51112177A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:In packaging the semiconductor equipment, prepare the board on which semiconductor chip is mounted, the insulator board and the radiation board on which solder is reserved. Adhere each of them after deciding the position to make the package of which radiation efficiency is superior.
JP50037090A 1975-03-27 1975-03-27 Semiconductor equipment Pending JPS51112177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50037090A JPS51112177A (en) 1975-03-27 1975-03-27 Semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50037090A JPS51112177A (en) 1975-03-27 1975-03-27 Semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS51112177A true JPS51112177A (en) 1976-10-04

Family

ID=12487850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50037090A Pending JPS51112177A (en) 1975-03-27 1975-03-27 Semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS51112177A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710258A (en) * 1980-05-20 1982-01-19 Gao Ges Automation Org Integrated circuit chip carrier element for identification card
JPS5810849A (en) * 1981-07-10 1983-01-21 Nec Corp Integrated circuit device
JPH01214032A (en) * 1988-02-22 1989-08-28 Canon Inc Electric circuit device
US4949158A (en) * 1987-07-24 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710258A (en) * 1980-05-20 1982-01-19 Gao Ges Automation Org Integrated circuit chip carrier element for identification card
JPH041499B2 (en) * 1980-05-20 1992-01-13 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS5810849A (en) * 1981-07-10 1983-01-21 Nec Corp Integrated circuit device
US4949158A (en) * 1987-07-24 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH01214032A (en) * 1988-02-22 1989-08-28 Canon Inc Electric circuit device

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