CA1021066A - Semiconductor chip interconnect package - Google Patents

Semiconductor chip interconnect package

Info

Publication number
CA1021066A
CA1021066A CA226,480A CA226480A CA1021066A CA 1021066 A CA1021066 A CA 1021066A CA 226480 A CA226480 A CA 226480A CA 1021066 A CA1021066 A CA 1021066A
Authority
CA
Canada
Prior art keywords
semiconductor chip
chip interconnect
interconnect package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA226,480A
Inventor
James B. Morris (Sr.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Microsystems Holding Corp
Original Assignee
American Microsystems Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Microsystems Holding Corp filed Critical American Microsystems Holding Corp
Application granted granted Critical
Publication of CA1021066A publication Critical patent/CA1021066A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CA226,480A 1974-10-17 1975-05-07 Semiconductor chip interconnect package Expired CA1021066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51558174A 1974-10-17 1974-10-17

Publications (1)

Publication Number Publication Date
CA1021066A true CA1021066A (en) 1977-11-15

Family

ID=24051933

Family Applications (1)

Application Number Title Priority Date Filing Date
CA226,480A Expired CA1021066A (en) 1974-10-17 1975-05-07 Semiconductor chip interconnect package

Country Status (4)

Country Link
JP (1) JPS5165569A (en)
CA (1) CA1021066A (en)
DE (1) DE2528573A1 (en)
FR (1) FR2288394A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008868A (en) * 1987-03-05 1991-04-16 Seiko Epson Corporation Structure for mounting an integrated circuit
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629982Y2 (en) * 1976-06-28 1981-07-16
FR2445024A1 (en) * 1978-12-22 1980-07-18 Radiotechnique Compelec Mounting of temp. compensated quartz crystal - utilises layer of silicon rubber between crystal case and metallic base, with five conductors passing through base to form plug pens
DE3003726C2 (en) * 1980-02-01 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Holder for electrical components
JPS6018843Y2 (en) * 1980-04-02 1985-06-07 萬世工業株式会社 Semiconductor package holding device
DE3300706C2 (en) * 1983-01-11 1986-08-28 Nixdorf Computer Ag, 4790 Paderborn Device for the plug-in assembly of an electrical circuit carrier on an electrical device or the like, as well as a method for producing the device
JPH01500705A (en) * 1983-07-11 1989-03-09 国際貿易株式会社 Electronic circuit chip connection assembly and method
EP0145327B1 (en) * 1983-11-15 1988-08-03 THE GENERAL ELECTRIC COMPANY, p.l.c. Electrical interface arrangement
DE3680336D1 (en) * 1985-12-20 1991-08-22 Hughes Aircraft Co COMPRESSIVE SOCKET FOR MICRO CONNECTIONS.
DE3701310A1 (en) * 1987-01-17 1988-07-28 Bodenseewerk Geraetetech Contact-making device for making contact with surface-mounted integrated circuits
JP2521361B2 (en) * 1990-06-26 1996-08-07 日本特殊陶業株式会社 Package for integrated circuit
DE59600700D1 (en) * 1995-09-08 1998-11-26 Siemens Ag Protective housing for semiconductor chips arranged on a circuit substrate with bond wires

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008868A (en) * 1987-03-05 1991-04-16 Seiko Epson Corporation Structure for mounting an integrated circuit
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
US5712831A (en) * 1987-07-21 1998-01-27 Seiko Epson Corporation Timepiece

Also Published As

Publication number Publication date
FR2288394A1 (en) 1976-05-14
JPS5165569A (en) 1976-06-07
DE2528573A1 (en) 1976-04-22

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