CA1032276A - Package for semiconductor beam lead devices - Google Patents

Package for semiconductor beam lead devices

Info

Publication number
CA1032276A
CA1032276A CA211,500A CA211500A CA1032276A CA 1032276 A CA1032276 A CA 1032276A CA 211500 A CA211500 A CA 211500A CA 1032276 A CA1032276 A CA 1032276A
Authority
CA
Canada
Prior art keywords
package
beam lead
lead devices
semiconductor beam
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA211,500A
Other languages
French (fr)
Other versions
CA211500S (en
Inventor
Andrew Koutalides
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of CA1032276A publication Critical patent/CA1032276A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
CA211,500A 1973-12-03 1974-10-16 Package for semiconductor beam lead devices Expired CA1032276A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42100473A 1973-12-03 1973-12-03

Publications (1)

Publication Number Publication Date
CA1032276A true CA1032276A (en) 1978-05-30

Family

ID=23668787

Family Applications (1)

Application Number Title Priority Date Filing Date
CA211,500A Expired CA1032276A (en) 1973-12-03 1974-10-16 Package for semiconductor beam lead devices

Country Status (7)

Country Link
JP (2) JPS5087587A (en)
CA (1) CA1032276A (en)
CH (1) CH585968A5 (en)
DE (1) DE2456951A1 (en)
FR (1) FR2253282B1 (en)
GB (1) GB1458846A (en)
SE (1) SE403852B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485262A1 (en) * 1980-06-19 1981-12-24 Thomson Csf ENCAPSULATION HOUSING RESISTANT TO HIGH EXTERNAL PRESSURES
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip
JPH04120765A (en) * 1990-09-12 1992-04-21 Seiko Epson Corp Semiconductor device and manufacture thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
DE2003423C3 (en) * 1970-01-27 1975-11-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method for contacting semiconductor arrangements
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
JPS4727491U (en) 1971-04-17 1972-11-28
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
JPS4836983A (en) 1971-09-10 1973-05-31

Also Published As

Publication number Publication date
JPS5860940U (en) 1983-04-25
FR2253282B1 (en) 1980-09-12
DE2456951A1 (en) 1975-06-05
GB1458846A (en) 1976-12-15
FR2253282A1 (en) 1975-06-27
SE7415064L (en) 1975-06-04
SE403852B (en) 1978-09-04
JPS5087587A (en) 1975-07-14
CH585968A5 (en) 1977-03-15

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