SE7415064L - - Google Patents

Info

Publication number
SE7415064L
SE7415064L SE7415064A SE7415064A SE7415064L SE 7415064 L SE7415064 L SE 7415064L SE 7415064 A SE7415064 A SE 7415064A SE 7415064 A SE7415064 A SE 7415064A SE 7415064 L SE7415064 L SE 7415064L
Authority
SE
Sweden
Prior art keywords
leads
semi
frame
lead frame
fingers
Prior art date
Application number
SE7415064A
Other versions
SE403852B (en
Inventor
A Koutalides
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of SE7415064L publication Critical patent/SE7415064L/xx
Publication of SE403852B publication Critical patent/SE403852B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

1458846 Semi-conductor devices RAYTHEON CO 4 Nov 1974 [3 Dec 1973] 47638/74 Heading H1K End portions 18 of the fingers of a lead frame to which beam leads 14 of semi-conductor chip device 18 are to be electrically connected are of reduced thickness compared with the rest of the lead frame. The tendency to twisting or lateral movement of the fingers under the bonding pressure is reduced, particularly if the ends are thinner than their width. As shown, the frame leads 16 are bonded to ceramic base 20 by glass layer 24, and encapsulation is completed by bonding ceramic cover 26 to the frame leads by glass layers 32. Preferably the co-efficients of thermal expansion of the various bonded parts substantially metal.
SE7415064A 1973-12-03 1974-12-02 SEMICONDUCTOR Capsule AND WAY TO MANUFACTURE THE SAME SE403852B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42100473A 1973-12-03 1973-12-03

Publications (2)

Publication Number Publication Date
SE7415064L true SE7415064L (en) 1975-06-04
SE403852B SE403852B (en) 1978-09-04

Family

ID=23668787

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7415064A SE403852B (en) 1973-12-03 1974-12-02 SEMICONDUCTOR Capsule AND WAY TO MANUFACTURE THE SAME

Country Status (7)

Country Link
JP (2) JPS5087587A (en)
CA (1) CA1032276A (en)
CH (1) CH585968A5 (en)
DE (1) DE2456951A1 (en)
FR (1) FR2253282B1 (en)
GB (1) GB1458846A (en)
SE (1) SE403852B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485262A1 (en) * 1980-06-19 1981-12-24 Thomson Csf ENCAPSULATION HOUSING RESISTANT TO HIGH EXTERNAL PRESSURES
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip
JPH04120765A (en) * 1990-09-12 1992-04-21 Seiko Epson Corp Semiconductor device and manufacture thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
DE2003423C3 (en) * 1970-01-27 1975-11-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method for contacting semiconductor arrangements
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
JPS4727491U (en) 1971-04-17 1972-11-28
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
JPS4836983A (en) 1971-09-10 1973-05-31

Also Published As

Publication number Publication date
SE403852B (en) 1978-09-04
JPS5087587A (en) 1975-07-14
FR2253282B1 (en) 1980-09-12
FR2253282A1 (en) 1975-06-27
DE2456951A1 (en) 1975-06-05
JPS5860940U (en) 1983-04-25
CA1032276A (en) 1978-05-30
GB1458846A (en) 1976-12-15
CH585968A5 (en) 1977-03-15

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