JPS6427236A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS6427236A
JPS6427236A JP18416587A JP18416587A JPS6427236A JP S6427236 A JPS6427236 A JP S6427236A JP 18416587 A JP18416587 A JP 18416587A JP 18416587 A JP18416587 A JP 18416587A JP S6427236 A JPS6427236 A JP S6427236A
Authority
JP
Japan
Prior art keywords
lead
bond
tape
wire bonding
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18416587A
Other languages
Japanese (ja)
Inventor
Hiroshi Kawashita
Hisao Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18416587A priority Critical patent/JPS6427236A/en
Publication of JPS6427236A publication Critical patent/JPS6427236A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a sufficiently bonded state by bonding in advance an insulation tape to a part near a die pad from a wire bond at the ends of inner leads. CONSTITUTION:A planar frame-like insulating tape 11 is bonded to the position near a die pad through a wire bond 5a at the end of an inner lead 4. A wire bonding which employs such a lead frame connects with wirings 5 the electrode 3a of a semiconductor element 3 to the wire bond 4a of the lead 4. In this case, the tape 11 is bonded in advance to a position near the die pad from the bond 4a at the end of the lead 4. Accordingly, the ends of many leads 4 can be aligned by the tape 11 on the same surface. Thus, the bond 4a on the lead 4 can be sufficiently bonded to the the wirings 5 at the time of wire bonding.
JP18416587A 1987-07-22 1987-07-22 Wire bonding method Pending JPS6427236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18416587A JPS6427236A (en) 1987-07-22 1987-07-22 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18416587A JPS6427236A (en) 1987-07-22 1987-07-22 Wire bonding method

Publications (1)

Publication Number Publication Date
JPS6427236A true JPS6427236A (en) 1989-01-30

Family

ID=16148501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18416587A Pending JPS6427236A (en) 1987-07-22 1987-07-22 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS6427236A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0342847A (en) * 1989-07-11 1991-02-25 Sony Corp Semiconductor device
JPH0616686U (en) * 1992-08-06 1994-03-04 株式会社大林組 Window sash

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0342847A (en) * 1989-07-11 1991-02-25 Sony Corp Semiconductor device
JPH0616686U (en) * 1992-08-06 1994-03-04 株式会社大林組 Window sash

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