JPS5087587A - - Google Patents

Info

Publication number
JPS5087587A
JPS5087587A JP13941974A JP13941974A JPS5087587A JP S5087587 A JPS5087587 A JP S5087587A JP 13941974 A JP13941974 A JP 13941974A JP 13941974 A JP13941974 A JP 13941974A JP S5087587 A JPS5087587 A JP S5087587A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13941974A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5087587A publication Critical patent/JPS5087587A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
JP13941974A 1973-12-03 1974-12-03 Pending JPS5087587A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42100473A 1973-12-03 1973-12-03

Publications (1)

Publication Number Publication Date
JPS5087587A true JPS5087587A (en) 1975-07-14

Family

ID=23668787

Family Applications (2)

Application Number Title Priority Date Filing Date
JP13941974A Pending JPS5087587A (en) 1973-12-03 1974-12-03
JP10241582U Pending JPS5860940U (en) 1973-12-03 1982-07-06 semiconductor package

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP10241582U Pending JPS5860940U (en) 1973-12-03 1982-07-06 semiconductor package

Country Status (7)

Country Link
JP (2) JPS5087587A (en)
CA (1) CA1032276A (en)
CH (1) CH585968A5 (en)
DE (1) DE2456951A1 (en)
FR (1) FR2253282B1 (en)
GB (1) GB1458846A (en)
SE (1) SE403852B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485262A1 (en) * 1980-06-19 1981-12-24 Thomson Csf ENCAPSULATION HOUSING RESISTANT TO HIGH EXTERNAL PRESSURES
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip
JPH04120765A (en) * 1990-09-12 1992-04-21 Seiko Epson Corp Semiconductor device and manufacture thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727491U (en) * 1971-04-17 1972-11-28
JPS4836983A (en) * 1971-09-10 1973-05-31

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
DE2003423C3 (en) * 1970-01-27 1975-11-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method for contacting semiconductor arrangements
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727491U (en) * 1971-04-17 1972-11-28
JPS4836983A (en) * 1971-09-10 1973-05-31

Also Published As

Publication number Publication date
SE403852B (en) 1978-09-04
FR2253282B1 (en) 1980-09-12
FR2253282A1 (en) 1975-06-27
DE2456951A1 (en) 1975-06-05
JPS5860940U (en) 1983-04-25
CA1032276A (en) 1978-05-30
SE7415064L (en) 1975-06-04
GB1458846A (en) 1976-12-15
CH585968A5 (en) 1977-03-15

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