FR2288394A1 - Semiconductor chip circuit connector - has container for semiconductor chip with spaced metallised connecting terminals - Google Patents

Semiconductor chip circuit connector - has container for semiconductor chip with spaced metallised connecting terminals

Info

Publication number
FR2288394A1
FR2288394A1 FR7518118A FR7518118A FR2288394A1 FR 2288394 A1 FR2288394 A1 FR 2288394A1 FR 7518118 A FR7518118 A FR 7518118A FR 7518118 A FR7518118 A FR 7518118A FR 2288394 A1 FR2288394 A1 FR 2288394A1
Authority
FR
France
Prior art keywords
semiconductor chip
casing
connecting terminals
metallised
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7518118A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Microsystems Holding Corp
Original Assignee
American Microsystems Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Microsystems Holding Corp filed Critical American Microsystems Holding Corp
Publication of FR2288394A1 publication Critical patent/FR2288394A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

The connecting device is intended for integrated semiconductor circuits on a suitable chip and consists of a casing (12) accepting the integrated semiconductor circuit (36) with several spaced, metallised connecting terminals (38). Inside the casing are arranged several spaced, upstanding protrusions (40, 58) in such a manner as to contact the connecting terminals, the protrusions being connected inside the casing to several electric conductors (34) which extend outside the casing. In the casing are adjusting elements (14) for the electric conductors for fitting the protrusions. The casing transmits a mechanical pressure onto the semiconductor circuit for connecting the protrusions and the conductors so as to connect the arrangement to an external circuit.
FR7518118A 1974-10-17 1975-06-10 Semiconductor chip circuit connector - has container for semiconductor chip with spaced metallised connecting terminals Withdrawn FR2288394A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51558174A 1974-10-17 1974-10-17

Publications (1)

Publication Number Publication Date
FR2288394A1 true FR2288394A1 (en) 1976-05-14

Family

ID=24051933

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7518118A Withdrawn FR2288394A1 (en) 1974-10-17 1975-06-10 Semiconductor chip circuit connector - has container for semiconductor chip with spaced metallised connecting terminals

Country Status (4)

Country Link
JP (1) JPS5165569A (en)
CA (1) CA1021066A (en)
DE (1) DE2528573A1 (en)
FR (1) FR2288394A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2445024A1 (en) * 1978-12-22 1980-07-18 Radiotechnique Compelec Mounting of temp. compensated quartz crystal - utilises layer of silicon rubber between crystal case and metallic base, with five conductors passing through base to form plug pens
EP0116162A2 (en) * 1983-01-11 1984-08-22 Siemens Nixdorf Informationssysteme Aktiengesellschaft Device for pluggable mounting an electrical circuit carrier on an electrical apparatus or the like and method of manufacturing it
WO1985000467A1 (en) * 1983-07-11 1985-01-31 Silicon Connection, Inc. Electronic circuit chip connection assembly and method
EP0145327A2 (en) * 1983-11-15 1985-06-19 THE GENERAL ELECTRIC COMPANY, p.l.c. Electrical interface arrangement
WO1987004009A1 (en) * 1985-12-20 1987-07-02 Hughes Aircraft Company Compressive pedestal for microminiature connections
US5008868A (en) * 1987-03-05 1991-04-16 Seiko Epson Corporation Structure for mounting an integrated circuit
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
EP0764984A2 (en) * 1995-09-08 1997-03-26 Siemens Aktiengesellschaft Protection housing for semiconductor chips bonded to a circuit substrate by means of bonding wires

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629982Y2 (en) * 1976-06-28 1981-07-16
DE3003726C2 (en) * 1980-02-01 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Holder for electrical components
JPS6018843Y2 (en) * 1980-04-02 1985-06-07 萬世工業株式会社 Semiconductor package holding device
DE3701310A1 (en) * 1987-01-17 1988-07-28 Bodenseewerk Geraetetech Contact-making device for making contact with surface-mounted integrated circuits
JP2521361B2 (en) * 1990-06-26 1996-08-07 日本特殊陶業株式会社 Package for integrated circuit

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2445024A1 (en) * 1978-12-22 1980-07-18 Radiotechnique Compelec Mounting of temp. compensated quartz crystal - utilises layer of silicon rubber between crystal case and metallic base, with five conductors passing through base to form plug pens
EP0116162A2 (en) * 1983-01-11 1984-08-22 Siemens Nixdorf Informationssysteme Aktiengesellschaft Device for pluggable mounting an electrical circuit carrier on an electrical apparatus or the like and method of manufacturing it
EP0116162A3 (en) * 1983-01-11 1985-09-11 Nixdorf Computer Aktiengesellschaft Device for pluggable mounting an electrical circuit carrier on an electrical apparatus or the like and method of manufacturing it
WO1985000467A1 (en) * 1983-07-11 1985-01-31 Silicon Connection, Inc. Electronic circuit chip connection assembly and method
EP0145327A2 (en) * 1983-11-15 1985-06-19 THE GENERAL ELECTRIC COMPANY, p.l.c. Electrical interface arrangement
EP0145327A3 (en) * 1983-11-15 1986-02-12 The General Electric Company, P.L.C. Electrical interface arrangement
WO1987004009A1 (en) * 1985-12-20 1987-07-02 Hughes Aircraft Company Compressive pedestal for microminiature connections
US5008868A (en) * 1987-03-05 1991-04-16 Seiko Epson Corporation Structure for mounting an integrated circuit
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
US5712831A (en) * 1987-07-21 1998-01-27 Seiko Epson Corporation Timepiece
EP0764984A2 (en) * 1995-09-08 1997-03-26 Siemens Aktiengesellschaft Protection housing for semiconductor chips bonded to a circuit substrate by means of bonding wires
EP0764984A3 (en) * 1995-09-08 1997-05-07 Siemens Ag

Also Published As

Publication number Publication date
CA1021066A (en) 1977-11-15
JPS5165569A (en) 1976-06-07
DE2528573A1 (en) 1976-04-22

Similar Documents

Publication Publication Date Title
FR2439478B1 (en)
US4249196A (en) Integrated circuit module with integral capacitor
FR2288394A1 (en) Semiconductor chip circuit connector - has container for semiconductor chip with spaced metallised connecting terminals
ES407293A1 (en) Connecting means for ceramic substrate package
US3784725A (en) Electronic hybrid package
ZA707080B (en) An electrical socket and an insulating carrier for an integrated circuit module
EP0218438A3 (en) Apparatus for mounting a semiconductor chip and making electrical connections thereto
SE8104663L (en) RELATIONSHIP FOR AN IC MODULE
JPS5427984A (en) Electric connector
MY102712A (en) A semiconductor component incorporated a power-mosfet and a control circuit
GB1197751A (en) Process for Packaging Multilead Semiconductor Devices and Resulting Product.
JPS52145772A (en) Device for electrically connecting perforated circuit substrate
JPS5779652A (en) Resin-sealed semiconductor device
UST955008I4 (en) Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate
DE3376874D1 (en) Integrated circuit sensor for force or displacement
JPS5721847A (en) Semiconductor device
JPS50137682A (en)
JPS54133878A (en) Semiconductor device
FR2379910B1 (en)
JPS5277587A (en) Wiring of integrated circuit outside chip
JPS56124240A (en) Semiconductor integrated circuit device
JPS5353261A (en) Electronic device
JPS6464332A (en) Manufacture of tape carrier type semiconductor device
JPS5483768A (en) Semiconductor device
JPS5290975A (en) Electronic wristwatch

Legal Events

Date Code Title Description
ST Notification of lapse