JPS5261963A - Leadframe for semiconductor device - Google Patents
Leadframe for semiconductor deviceInfo
- Publication number
- JPS5261963A JPS5261963A JP4016376A JP4016376A JPS5261963A JP S5261963 A JPS5261963 A JP S5261963A JP 4016376 A JP4016376 A JP 4016376A JP 4016376 A JP4016376 A JP 4016376A JP S5261963 A JPS5261963 A JP S5261963A
- Authority
- JP
- Japan
- Prior art keywords
- leadframe
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/633,045 US4048438A (en) | 1974-10-23 | 1975-11-18 | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5261963A true JPS5261963A (en) | 1977-05-21 |
Family
ID=24538059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4016376A Pending JPS5261963A (en) | 1975-11-18 | 1976-04-08 | Leadframe for semiconductor device |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5261963A (en) |
BR (1) | BR7602449A (en) |
CA (1) | CA1053379A (en) |
DE (1) | DE2614930A1 (en) |
ES (1) | ES447245A1 (en) |
FR (1) | FR2332620A1 (en) |
GB (1) | GB1509142A (en) |
IT (1) | IT1059111B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2753236C2 (en) * | 1977-11-29 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Installation frame for an integrated semiconductor circuit arrangement without a housing |
FR2518813A1 (en) * | 1981-12-22 | 1983-06-24 | Socapex | INTERCONNECTION BRACKET FOR AN INTEGRATED CIRCUIT BOX ON A PRINTED CIRCUIT AND INTERCONNECTION SYSTEM USING SUCH A SUPPORT |
FR2521350B1 (en) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | SEMICONDUCTOR CHIP HOLDER |
EP0641019A3 (en) * | 1993-08-27 | 1995-12-20 | Poly Flex Circuits Inc | A flexible printed polymer lead-frame. |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7014131A (en) * | 1970-09-24 | 1972-03-28 | ||
US3777365A (en) * | 1972-03-06 | 1973-12-11 | Honeywell Inf Systems | Circuit chips having beam leads attached by film strip process |
US3778686A (en) * | 1972-08-18 | 1973-12-11 | Motorola Inc | Carrier for beam lead integrated circuits |
-
1976
- 1976-03-31 GB GB1291176A patent/GB1509142A/en not_active Expired
- 1976-03-31 CA CA249,325A patent/CA1053379A/en not_active Expired
- 1976-04-07 DE DE19762614930 patent/DE2614930A1/en not_active Withdrawn
- 1976-04-08 JP JP4016376A patent/JPS5261963A/en active Pending
- 1976-04-14 IT IT2232676A patent/IT1059111B/en active
- 1976-04-22 BR BR7602449A patent/BR7602449A/en unknown
- 1976-04-22 ES ES447245A patent/ES447245A1/en not_active Expired
- 1976-04-22 FR FR7611962A patent/FR2332620A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2332620A1 (en) | 1977-06-17 |
GB1509142A (en) | 1978-04-26 |
ES447245A1 (en) | 1977-06-16 |
CA1053379A (en) | 1979-04-24 |
BR7602449A (en) | 1977-05-10 |
IT1059111B (en) | 1982-05-31 |
FR2332620B1 (en) | 1982-11-12 |
DE2614930A1 (en) | 1977-06-02 |
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