GB1509142A - Lead assembly - Google Patents
Lead assemblyInfo
- Publication number
- GB1509142A GB1509142A GB1291176A GB1291176A GB1509142A GB 1509142 A GB1509142 A GB 1509142A GB 1291176 A GB1291176 A GB 1291176A GB 1291176 A GB1291176 A GB 1291176A GB 1509142 A GB1509142 A GB 1509142A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fingers
- sheet
- support sheet
- lead assembly
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
1509142 Semiconductor devices AMP Inc 31 March 1976 [18 Nov 1975] 12911/76 Heading H1K A plurality of convergent metal fingers 16, the inner ends of which define an area in or over which a semiconductor chip is to be received with its contacts connected to the fingers 16, is bonded to an insulating support sheet 10, at least some of the support sheet 10 having been removed both from the chip receiving area and from the outer ends of the fingers, but the fingers 16 remaining supported by the sheet 10 throughout their lengths. The arrangement allows for differential thermal expansion between the sheet 10 and fingers 16 while maintaining adequate support for the latter. A plurality of such arrays of fingers may be provided on a common support sheet.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/633,045 US4048438A (en) | 1974-10-23 | 1975-11-18 | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1509142A true GB1509142A (en) | 1978-04-26 |
Family
ID=24538059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1291176A Expired GB1509142A (en) | 1975-11-18 | 1976-03-31 | Lead assembly |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5261963A (en) |
BR (1) | BR7602449A (en) |
CA (1) | CA1053379A (en) |
DE (1) | DE2614930A1 (en) |
ES (1) | ES447245A1 (en) |
FR (1) | FR2332620A1 (en) |
GB (1) | GB1509142A (en) |
IT (1) | IT1059111B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138210A (en) * | 1982-02-05 | 1984-10-17 | Hitachi Ltd | A multiple frame |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2753236C2 (en) * | 1977-11-29 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Installation frame for an integrated semiconductor circuit arrangement without a housing |
FR2518813A1 (en) * | 1981-12-22 | 1983-06-24 | Socapex | INTERCONNECTION BRACKET FOR AN INTEGRATED CIRCUIT BOX ON A PRINTED CIRCUIT AND INTERCONNECTION SYSTEM USING SUCH A SUPPORT |
EP0641019A3 (en) * | 1993-08-27 | 1995-12-20 | Poly Flex Circuits Inc | A flexible printed polymer lead-frame. |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7014131A (en) * | 1970-09-24 | 1972-03-28 | ||
US3777365A (en) * | 1972-03-06 | 1973-12-11 | Honeywell Inf Systems | Circuit chips having beam leads attached by film strip process |
US3778686A (en) * | 1972-08-18 | 1973-12-11 | Motorola Inc | Carrier for beam lead integrated circuits |
-
1976
- 1976-03-31 GB GB1291176A patent/GB1509142A/en not_active Expired
- 1976-03-31 CA CA249,325A patent/CA1053379A/en not_active Expired
- 1976-04-07 DE DE19762614930 patent/DE2614930A1/en not_active Withdrawn
- 1976-04-08 JP JP4016376A patent/JPS5261963A/en active Pending
- 1976-04-14 IT IT2232676A patent/IT1059111B/en active
- 1976-04-22 ES ES447245A patent/ES447245A1/en not_active Expired
- 1976-04-22 BR BR7602449A patent/BR7602449A/en unknown
- 1976-04-22 FR FR7611962A patent/FR2332620A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138210A (en) * | 1982-02-05 | 1984-10-17 | Hitachi Ltd | A multiple frame |
Also Published As
Publication number | Publication date |
---|---|
BR7602449A (en) | 1977-05-10 |
FR2332620A1 (en) | 1977-06-17 |
FR2332620B1 (en) | 1982-11-12 |
JPS5261963A (en) | 1977-05-21 |
CA1053379A (en) | 1979-04-24 |
IT1059111B (en) | 1982-05-31 |
DE2614930A1 (en) | 1977-06-02 |
ES447245A1 (en) | 1977-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19940331 |