CA1053379A - Lead frames on plastic films - Google Patents
Lead frames on plastic filmsInfo
- Publication number
- CA1053379A CA1053379A CA249,325A CA249325A CA1053379A CA 1053379 A CA1053379 A CA 1053379A CA 249325 A CA249325 A CA 249325A CA 1053379 A CA1053379 A CA 1053379A
- Authority
- CA
- Canada
- Prior art keywords
- fingers
- semiconductor device
- supporting sheet
- lead frame
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
ABSTRACT
A lead frame for a semiconductor device comprises a plurality of convergent metal fingers carried by a supporting sheet of electrically insulating material, the inner adjacent ends of the fingers defining a semiconductor device receiving area from which all or at least some of the supporting sheet has been removed.
A lead frame for a semiconductor device comprises a plurality of convergent metal fingers carried by a supporting sheet of electrically insulating material, the inner adjacent ends of the fingers defining a semiconductor device receiving area from which all or at least some of the supporting sheet has been removed.
Description
B745 ~;
33~i9 This invention relates.to a lead frame for a semiconductor device, and particularly to such a lead .
frame comprising a supportin~ sheet of electrically insulatinq material having a plurality of converqent ~
metal finqers bonded to ~ne surface thereof, each for ~ .
connection to an individual contact of a semiconductor device, the inner adjacent ends of the f~naers definina, an area in or over which the semiconductor devic~ is to ~ :
be received 7 , '.' '~
~wo forms of such a lead frame are known.
In one orm the supporti.ng sheet is continuous over the whole area defined by the metal fingers, including -the semiconductor device receivina, area, and in the other form the supDorting sheet is removed from the semiconductor device receivina area, and inner end port~ons of the metal fingers project out over th~ hol~ in t~ë supportin~
sheet constituting~the semiconductor device receiving area. .
Both these known forms of lead frame have a number ~f disadvanta~es, ' ~ -For example, when the metal fingers are fully supported bv a complete supporting sheet there is the particular j :
disadvantage that undue stresses can build up on the fingers due to differential thermal expansion between the support ..
sheet and the fingers when heat is applied to bond a semi-conductor device thereto, and/or when ~hermal variations occur during normal use. Such expansi.on can cause sufflciently ~ .
large distortion of the supporting sheet during the bondinq of.the fingers to the contacts ~f a semiconductor device to cause the bonds to be defective, or even to break the semiconductor device d~lring later thermal cyclinq, should , ... .
33~i9 This invention relates.to a lead frame for a semiconductor device, and particularly to such a lead .
frame comprising a supportin~ sheet of electrically insulatinq material having a plurality of converqent ~
metal finqers bonded to ~ne surface thereof, each for ~ .
connection to an individual contact of a semiconductor device, the inner adjacent ends of the f~naers definina, an area in or over which the semiconductor devic~ is to ~ :
be received 7 , '.' '~
~wo forms of such a lead frame are known.
In one orm the supporti.ng sheet is continuous over the whole area defined by the metal fingers, including -the semiconductor device receivina, area, and in the other form the supDorting sheet is removed from the semiconductor device receivina area, and inner end port~ons of the metal fingers project out over th~ hol~ in t~ë supportin~
sheet constituting~the semiconductor device receiving area. .
Both these known forms of lead frame have a number ~f disadvanta~es, ' ~ -For example, when the metal fingers are fully supported bv a complete supporting sheet there is the particular j :
disadvantage that undue stresses can build up on the fingers due to differential thermal expansion between the support ..
sheet and the fingers when heat is applied to bond a semi-conductor device thereto, and/or when ~hermal variations occur during normal use. Such expansi.on can cause sufflciently ~ .
large distortion of the supporting sheet during the bondinq of.the fingers to the contacts ~f a semiconductor device to cause the bonds to be defective, or even to break the semiconductor device d~lring later thermal cyclinq, should , ... .
2.
~5~3~9 8745 ~' .
the bonds be of sufficient stxen~th.
In the other known form in ~hich inner end portions of the fingers extend over a hole in the supporting sheet, - the above discussed problem of undue stress build-up does not normally occur, but instead there is the problem of supporting the fingers during fabrication ancl handling of the lead frame, in order to maintain the necessary coplanar predetermined array o the fingers prior to the bonding of a semiconductor devlce thexeto. Thus, with this known form there is the disadvantage that the fingers can be easily and permanently damaged prior to use of the lead frame, thus sukstantially increasing ~raste and cost.
The conventional method of attaching semiconductor devices to a circuit using kno~n lead frames has been a two step method. First the semiconductor device is bonded to the lead frame, which is supported on a carrier and then this assembly ls separated from the carrler and bonded to the cl rcuit. Clearly this method has the disadvantage of multiple steps during ~rhich the fingers can easily become misallgned making the assembly useless. ~
According to this invention a lead frame of the ;
general type set out above ls characterised in that all ,~
or at least so~e of the supporting sheet has been removed from the semlconductor device receiving area, but with the metal fingers remaining supported by the supporting sheet throughout their length.
Such a lead frame allows for differntial thermal `
expansion between the sup~ortinq sheet and the metal fingers, thus ensuring reliable initial honding, and - - ' ~. , ~
16J~S~3r~'9 maintenance of the bondin~ between the fingers and the contacts of a semiconductor device ~onded to the lead frame, while still providing sUPport for the fingers at all times and thereby preventing or at least minimising damage to the f~ngers.
The metal ingers can be integrally formed with a surrounding metal frame memher which can be suhsequentlY
broken and/or removed to isolate the fingers from each other as requir~d.
A plurallty of lead frames according to this ~;
invention can be provided in line on a co~mon supportin~
sheet of electrically insulating material, the lead frames either havin~ all their metal fingers electrically isolated ~-~,.... .
from each other, or having certain metal fingers electricallv connected to provide a complete network or circuit. ' Such an assembly has the advantage that the lead frames can easily and economically be produced by passage o the common supporting sheet through a station at which the metal fingers are formed on the supporting sheet by a known plating technique~
To facilitate such manufacture the supporting sheet is preferably provided with spaced registration holes to ensure accurate relative positioning of the metal fingers on the supporting sheet.
~5 This invention will now be described by ~ay of -example with reference to the drawings in which:-Figure 1 is a plan view of a first lead frame according to the invention;
Figure 2 is a vertical section through the lead frame of Figure 1 showing the attachment of a semlconductoF
,. : -874s ~6~5~337~
device to the lead frame;
Figure 3 is a plan vi~w of a second lead frame according to the invention; and Fiqure 4 is a plan view of a third lead frame accordin~ to the invention.
Referrinq to Figure 1, the lea~ frame comprises a flexible electrically insulating support sheet 10 of polymide material havinq a plurality of reqistration holes 12 spaced alon~ the opposite edges thereof. A metal me~ber is formed on the sheet 10 to have a plurality of fingers 16 extend~n~ from a surro~nding frame member 14 up to the periphery of a central hole 18 formed in the sheet 10. The hole 18 serves to provide stress relief for the connections between the finqers lG and the sheet 10 when heat is applied during bonding of a semiconductor device to the fingers 16, and thereafter.
Figure 2 shows a vertical section throu~h the lead f~ame of Fiqure 1 with a semiconductor device 20 bonded thereto. As shown the ~rame member 14 and fingers 16 comprise a copper member 24 having a surface layer 26 of, for example, gold thereon. The device 20 carries bumped metallized pads 28 in alignment with the fingers 16.
The device 20 is honded to the lead frame in known manner, for example, by solder reflow, thermal compression or eutectic die attachment.
In the lead frame shown in Figure 3, in order to obtain the desired stress re~ief, the supportin~ sheet 10 has therein a star confiauration hole 30 formed by two inte~secting slots 32 and 34. Each slo~ 32 or 34 has a round hole 36 or 38 at each end to prevent tearing of the 5.
.
lLO$337J9 sheet 10 beyond the slot 32 or 34. This star pattern of slots will provide the same function as the hole 18 of Fi~ures 1 and 2, namely, it will compensate for stresses which build up in the bonds between the fingers 16 and the sheet 10 due to differential thermal expansion between t~e sheet 10 and the ingers 16.
In the lead frame shown in Figure 4I the fingers 16 extend from the hole 18 to the edge of urther holes 40 `:
in the sheet 10, there being no frame member as found in the lead frames of Figures 1 and 3. These further holes 40 serve to further enhance the stress relief provided by the central hole 18.
' ':.
. `.: ; :
`. ' .
~
' .
~
~ ., .
:' . ' -~
.
'~ :~
" ~, 6. .
;
~.
. . . . . . , ~ ,
~5~3~9 8745 ~' .
the bonds be of sufficient stxen~th.
In the other known form in ~hich inner end portions of the fingers extend over a hole in the supporting sheet, - the above discussed problem of undue stress build-up does not normally occur, but instead there is the problem of supporting the fingers during fabrication ancl handling of the lead frame, in order to maintain the necessary coplanar predetermined array o the fingers prior to the bonding of a semiconductor devlce thexeto. Thus, with this known form there is the disadvantage that the fingers can be easily and permanently damaged prior to use of the lead frame, thus sukstantially increasing ~raste and cost.
The conventional method of attaching semiconductor devices to a circuit using kno~n lead frames has been a two step method. First the semiconductor device is bonded to the lead frame, which is supported on a carrier and then this assembly ls separated from the carrler and bonded to the cl rcuit. Clearly this method has the disadvantage of multiple steps during ~rhich the fingers can easily become misallgned making the assembly useless. ~
According to this invention a lead frame of the ;
general type set out above ls characterised in that all ,~
or at least so~e of the supporting sheet has been removed from the semlconductor device receiving area, but with the metal fingers remaining supported by the supporting sheet throughout their length.
Such a lead frame allows for differntial thermal `
expansion between the sup~ortinq sheet and the metal fingers, thus ensuring reliable initial honding, and - - ' ~. , ~
16J~S~3r~'9 maintenance of the bondin~ between the fingers and the contacts of a semiconductor device ~onded to the lead frame, while still providing sUPport for the fingers at all times and thereby preventing or at least minimising damage to the f~ngers.
The metal ingers can be integrally formed with a surrounding metal frame memher which can be suhsequentlY
broken and/or removed to isolate the fingers from each other as requir~d.
A plurallty of lead frames according to this ~;
invention can be provided in line on a co~mon supportin~
sheet of electrically insulating material, the lead frames either havin~ all their metal fingers electrically isolated ~-~,.... .
from each other, or having certain metal fingers electricallv connected to provide a complete network or circuit. ' Such an assembly has the advantage that the lead frames can easily and economically be produced by passage o the common supporting sheet through a station at which the metal fingers are formed on the supporting sheet by a known plating technique~
To facilitate such manufacture the supporting sheet is preferably provided with spaced registration holes to ensure accurate relative positioning of the metal fingers on the supporting sheet.
~5 This invention will now be described by ~ay of -example with reference to the drawings in which:-Figure 1 is a plan view of a first lead frame according to the invention;
Figure 2 is a vertical section through the lead frame of Figure 1 showing the attachment of a semlconductoF
,. : -874s ~6~5~337~
device to the lead frame;
Figure 3 is a plan vi~w of a second lead frame according to the invention; and Fiqure 4 is a plan view of a third lead frame accordin~ to the invention.
Referrinq to Figure 1, the lea~ frame comprises a flexible electrically insulating support sheet 10 of polymide material havinq a plurality of reqistration holes 12 spaced alon~ the opposite edges thereof. A metal me~ber is formed on the sheet 10 to have a plurality of fingers 16 extend~n~ from a surro~nding frame member 14 up to the periphery of a central hole 18 formed in the sheet 10. The hole 18 serves to provide stress relief for the connections between the finqers lG and the sheet 10 when heat is applied during bonding of a semiconductor device to the fingers 16, and thereafter.
Figure 2 shows a vertical section throu~h the lead f~ame of Fiqure 1 with a semiconductor device 20 bonded thereto. As shown the ~rame member 14 and fingers 16 comprise a copper member 24 having a surface layer 26 of, for example, gold thereon. The device 20 carries bumped metallized pads 28 in alignment with the fingers 16.
The device 20 is honded to the lead frame in known manner, for example, by solder reflow, thermal compression or eutectic die attachment.
In the lead frame shown in Figure 3, in order to obtain the desired stress re~ief, the supportin~ sheet 10 has therein a star confiauration hole 30 formed by two inte~secting slots 32 and 34. Each slo~ 32 or 34 has a round hole 36 or 38 at each end to prevent tearing of the 5.
.
lLO$337J9 sheet 10 beyond the slot 32 or 34. This star pattern of slots will provide the same function as the hole 18 of Fi~ures 1 and 2, namely, it will compensate for stresses which build up in the bonds between the fingers 16 and the sheet 10 due to differential thermal expansion between t~e sheet 10 and the ingers 16.
In the lead frame shown in Figure 4I the fingers 16 extend from the hole 18 to the edge of urther holes 40 `:
in the sheet 10, there being no frame member as found in the lead frames of Figures 1 and 3. These further holes 40 serve to further enhance the stress relief provided by the central hole 18.
' ':.
. `.: ; :
`. ' .
~
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~
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.
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;
~.
. . . . . . , ~ ,
Claims (4)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A lead frame for a semiconductor device, comprising a supporting sheet of electrically insulating material having a plurality of convergent metal fingers bonded to one surface thereof, each for connection to an individual contact of a semiconductor device, the inner adjacent ends of the fingers defining an area in or over which the semiconductor device is to be received, in which all or at least some of the supporting sheet has been removed from the semiconductor device receiving area but with the metal fingers remaining supported by the supporting sheet throughout their length.
2. A lead frame as claimed in Claim 1, in which holes are formed in the supporting sheet at the outer ends of the metal fingers.
3. A lead frame as claimed in Claim 1, in which the metal fingers are integrally formed with a surrounding metal frame member.
4. A plurality of lead frames as claimed in Claim 1, 2 or 3 having a common supporting sheet.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/633,045 US4048438A (en) | 1974-10-23 | 1975-11-18 | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1053379A true CA1053379A (en) | 1979-04-24 |
Family
ID=24538059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA249,325A Expired CA1053379A (en) | 1975-11-18 | 1976-03-31 | Lead frames on plastic films |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS5261963A (en) |
| BR (1) | BR7602449A (en) |
| CA (1) | CA1053379A (en) |
| DE (1) | DE2614930A1 (en) |
| ES (1) | ES447245A1 (en) |
| FR (1) | FR2332620A1 (en) |
| GB (1) | GB1509142A (en) |
| IT (1) | IT1059111B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2753236C2 (en) * | 1977-11-29 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Installation frame for an integrated semiconductor circuit arrangement without a housing |
| FR2518813A1 (en) * | 1981-12-22 | 1983-06-24 | Socapex | INTERCONNECTION BRACKET FOR AN INTEGRATED CIRCUIT BOX ON A PRINTED CIRCUIT AND INTERCONNECTION SYSTEM USING SUCH A SUPPORT |
| FR2521350B1 (en) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | SEMICONDUCTOR CHIP HOLDER |
| EP0641019A3 (en) * | 1993-08-27 | 1995-12-20 | Poly Flex Circuits Inc | A flexible printed polymer lead-frame. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7014131A (en) * | 1970-09-24 | 1972-03-28 | ||
| US3777365A (en) * | 1972-03-06 | 1973-12-11 | Honeywell Inf Systems | Circuit chips having beam leads attached by film strip process |
| US3778686A (en) * | 1972-08-18 | 1973-12-11 | Motorola Inc | Carrier for beam lead integrated circuits |
-
1976
- 1976-03-31 GB GB1291176A patent/GB1509142A/en not_active Expired
- 1976-03-31 CA CA249,325A patent/CA1053379A/en not_active Expired
- 1976-04-07 DE DE19762614930 patent/DE2614930A1/en not_active Withdrawn
- 1976-04-08 JP JP4016376A patent/JPS5261963A/en active Pending
- 1976-04-14 IT IT2232676A patent/IT1059111B/en active
- 1976-04-22 ES ES447245A patent/ES447245A1/en not_active Expired
- 1976-04-22 BR BR7602449A patent/BR7602449A/en unknown
- 1976-04-22 FR FR7611962A patent/FR2332620A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB1509142A (en) | 1978-04-26 |
| BR7602449A (en) | 1977-05-10 |
| FR2332620A1 (en) | 1977-06-17 |
| FR2332620B1 (en) | 1982-11-12 |
| JPS5261963A (en) | 1977-05-21 |
| IT1059111B (en) | 1982-05-31 |
| DE2614930A1 (en) | 1977-06-02 |
| ES447245A1 (en) | 1977-06-16 |
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