JPS5487173A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5487173A JPS5487173A JP15448777A JP15448777A JPS5487173A JP S5487173 A JPS5487173 A JP S5487173A JP 15448777 A JP15448777 A JP 15448777A JP 15448777 A JP15448777 A JP 15448777A JP S5487173 A JPS5487173 A JP S5487173A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- lead
- bump
- constitution
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To achieve complicated and high function at limited space, by locating two semiconductor chips oposingly by bridging the leads and by bonding the bump or bump and lead on the opposing planes.
CONSTITUTION: A number of bump electrodes 14a,14b,16a,16b are provided for the IC chips 14 and 16 for the surface, and the electrodes 14a and 14b are bonded with the lead 12 corresponding to the carrier tape 10. The chip 16 is laminated on the chip 14 and the electrodes 16a,16b are bonded with the electrodes 14a,14b or the lead 12. As required, dummy bumps are provided. After that, sealing is made by dropping the liquid resin 18. With this constitution, complicated and high function device can be manufactured in a limited space.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15448777A JPS5487173A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15448777A JPS5487173A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5487173A true JPS5487173A (en) | 1979-07-11 |
Family
ID=15585310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15448777A Pending JPS5487173A (en) | 1977-12-23 | 1977-12-23 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5487173A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55143059A (en) * | 1979-04-26 | 1980-11-08 | Nec Corp | Integrated circuit device |
JPS5810839A (en) * | 1981-07-14 | 1983-01-21 | Mitsubishi Electric Corp | Semiconductor device |
JPS63131561A (en) * | 1986-11-18 | 1988-06-03 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Electronic package |
JPH0216762A (en) * | 1988-05-02 | 1990-01-19 | Internatl Business Mach Corp <Ibm> | Electronic device package |
JPH0341758A (en) * | 1989-07-10 | 1991-02-22 | Nec Corp | Semiconductor integrated circuit device |
JPH05183010A (en) * | 1991-06-01 | 1993-07-23 | Goldstar Electron Co Ltd | Laminated type semiconductor package |
WO1998033217A1 (en) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing thereof |
-
1977
- 1977-12-23 JP JP15448777A patent/JPS5487173A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55143059A (en) * | 1979-04-26 | 1980-11-08 | Nec Corp | Integrated circuit device |
JPS5810839A (en) * | 1981-07-14 | 1983-01-21 | Mitsubishi Electric Corp | Semiconductor device |
JPS628033B2 (en) * | 1981-07-14 | 1987-02-20 | Mitsubishi Electric Corp | |
JPS63131561A (en) * | 1986-11-18 | 1988-06-03 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Electronic package |
JPH0477469B2 (en) * | 1986-11-18 | 1992-12-08 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPH0216762A (en) * | 1988-05-02 | 1990-01-19 | Internatl Business Mach Corp <Ibm> | Electronic device package |
JPH0341758A (en) * | 1989-07-10 | 1991-02-22 | Nec Corp | Semiconductor integrated circuit device |
JPH05183010A (en) * | 1991-06-01 | 1993-07-23 | Goldstar Electron Co Ltd | Laminated type semiconductor package |
WO1998033217A1 (en) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing thereof |
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