JPS5487173A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5487173A
JPS5487173A JP15448777A JP15448777A JPS5487173A JP S5487173 A JPS5487173 A JP S5487173A JP 15448777 A JP15448777 A JP 15448777A JP 15448777 A JP15448777 A JP 15448777A JP S5487173 A JPS5487173 A JP S5487173A
Authority
JP
Japan
Prior art keywords
electrodes
lead
bump
constitution
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15448777A
Other languages
Japanese (ja)
Inventor
Kazutaka Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15448777A priority Critical patent/JPS5487173A/en
Publication of JPS5487173A publication Critical patent/JPS5487173A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Abstract

PURPOSE: To achieve complicated and high function at limited space, by locating two semiconductor chips oposingly by bridging the leads and by bonding the bump or bump and lead on the opposing planes.
CONSTITUTION: A number of bump electrodes 14a,14b,16a,16b are provided for the IC chips 14 and 16 for the surface, and the electrodes 14a and 14b are bonded with the lead 12 corresponding to the carrier tape 10. The chip 16 is laminated on the chip 14 and the electrodes 16a,16b are bonded with the electrodes 14a,14b or the lead 12. As required, dummy bumps are provided. After that, sealing is made by dropping the liquid resin 18. With this constitution, complicated and high function device can be manufactured in a limited space.
COPYRIGHT: (C)1979,JPO&Japio
JP15448777A 1977-12-23 1977-12-23 Semiconductor device Pending JPS5487173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15448777A JPS5487173A (en) 1977-12-23 1977-12-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15448777A JPS5487173A (en) 1977-12-23 1977-12-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5487173A true JPS5487173A (en) 1979-07-11

Family

ID=15585310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15448777A Pending JPS5487173A (en) 1977-12-23 1977-12-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5487173A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55143059A (en) * 1979-04-26 1980-11-08 Nec Corp Integrated circuit device
JPS5810839A (en) * 1981-07-14 1983-01-21 Mitsubishi Electric Corp Semiconductor device
JPS63131561A (en) * 1986-11-18 1988-06-03 Ibm Electronic package
JPH0216762A (en) * 1988-05-02 1990-01-19 Internatl Business Mach Corp <Ibm> Electronic device package
JPH0341758A (en) * 1989-07-10 1991-02-22 Nec Corp Semiconductor integrated circuit device
JPH05183010A (en) * 1991-06-01 1993-07-23 Goldstar Electron Co Ltd Laminated type semiconductor package
WO1998033217A1 (en) * 1997-01-24 1998-07-30 Rohm Co., Ltd. Semiconductor device and method for manufacturing thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55143059A (en) * 1979-04-26 1980-11-08 Nec Corp Integrated circuit device
JPS5810839A (en) * 1981-07-14 1983-01-21 Mitsubishi Electric Corp Semiconductor device
JPS628033B2 (en) * 1981-07-14 1987-02-20 Mitsubishi Electric Corp
JPS63131561A (en) * 1986-11-18 1988-06-03 Ibm Electronic package
JPH0477469B2 (en) * 1986-11-18 1992-12-08 Intaanashonaru Bijinesu Mashiinzu Corp
JPH0216762A (en) * 1988-05-02 1990-01-19 Internatl Business Mach Corp <Ibm> Electronic device package
JPH0341758A (en) * 1989-07-10 1991-02-22 Nec Corp Semiconductor integrated circuit device
JPH05183010A (en) * 1991-06-01 1993-07-23 Goldstar Electron Co Ltd Laminated type semiconductor package
WO1998033217A1 (en) * 1997-01-24 1998-07-30 Rohm Co., Ltd. Semiconductor device and method for manufacturing thereof

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