JPS5358764A - Bonding method of flip chip - Google Patents

Bonding method of flip chip

Info

Publication number
JPS5358764A
JPS5358764A JP13348976A JP13348976A JPS5358764A JP S5358764 A JPS5358764 A JP S5358764A JP 13348976 A JP13348976 A JP 13348976A JP 13348976 A JP13348976 A JP 13348976A JP S5358764 A JPS5358764 A JP S5358764A
Authority
JP
Japan
Prior art keywords
flip chip
bonding method
defective
flip
pincette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13348976A
Other languages
Japanese (ja)
Inventor
Masayuki Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13348976A priority Critical patent/JPS5358764A/en
Publication of JPS5358764A publication Critical patent/JPS5358764A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75754—Guiding structures
    • H01L2224/75756—Guiding structures in the upper part of the bonding apparatus, e.g. in the bonding head

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: Assessment of non-defective and defective of flip chips is facilitated by transferring the flip chip to a pincette by rotating it 180°.
COPYRIGHT: (C)1978,JPO&Japio
JP13348976A 1976-11-06 1976-11-06 Bonding method of flip chip Pending JPS5358764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13348976A JPS5358764A (en) 1976-11-06 1976-11-06 Bonding method of flip chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13348976A JPS5358764A (en) 1976-11-06 1976-11-06 Bonding method of flip chip

Publications (1)

Publication Number Publication Date
JPS5358764A true JPS5358764A (en) 1978-05-26

Family

ID=15105954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13348976A Pending JPS5358764A (en) 1976-11-06 1976-11-06 Bonding method of flip chip

Country Status (1)

Country Link
JP (1) JPS5358764A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151552A (en) * 2000-11-13 2002-05-24 Nec Corp Semiconductor manufacturing apparatus
JP2007311683A (en) * 2006-05-22 2007-11-29 Matsushita Electric Ind Co Ltd Sticking method and apparatus therefor
JP2009117428A (en) * 2007-11-01 2009-05-28 Hitachi Ltd Method for power semiconductor module, fabrication, its apparatus, power semiconductor module thereof and its junction method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151552A (en) * 2000-11-13 2002-05-24 Nec Corp Semiconductor manufacturing apparatus
JP2007311683A (en) * 2006-05-22 2007-11-29 Matsushita Electric Ind Co Ltd Sticking method and apparatus therefor
JP2009117428A (en) * 2007-11-01 2009-05-28 Hitachi Ltd Method for power semiconductor module, fabrication, its apparatus, power semiconductor module thereof and its junction method

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