JPS51117574A - Semiconductor equipment - Google Patents

Semiconductor equipment

Info

Publication number
JPS51117574A
JPS51117574A JP50042482A JP4248275A JPS51117574A JP S51117574 A JPS51117574 A JP S51117574A JP 50042482 A JP50042482 A JP 50042482A JP 4248275 A JP4248275 A JP 4248275A JP S51117574 A JPS51117574 A JP S51117574A
Authority
JP
Japan
Prior art keywords
semiconductor equipment
bump
low cost
bonding pad
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50042482A
Other languages
Japanese (ja)
Other versions
JPS5826175B2 (en
Inventor
Takeo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP50042482A priority Critical patent/JPS5826175B2/en
Publication of JPS51117574A publication Critical patent/JPS51117574A/en
Publication of JPS5826175B2 publication Critical patent/JPS5826175B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To form a process reduced and low cost bump by printing mixed paste to form a soldering bump at a time when a bump is to be formed on an Al bonding pad.
COPYRIGHT: (C)1976,JPO&Japio
JP50042482A 1975-04-08 1975-04-08 Manufacturing method of semiconductor device Expired JPS5826175B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50042482A JPS5826175B2 (en) 1975-04-08 1975-04-08 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50042482A JPS5826175B2 (en) 1975-04-08 1975-04-08 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS51117574A true JPS51117574A (en) 1976-10-15
JPS5826175B2 JPS5826175B2 (en) 1983-06-01

Family

ID=12637267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50042482A Expired JPS5826175B2 (en) 1975-04-08 1975-04-08 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5826175B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592142U (en) * 1983-04-20 1984-01-09 セイコーエプソン株式会社 semiconductor integrated circuit
JPS60224248A (en) * 1984-04-23 1985-11-08 Oki Electric Ind Co Ltd Manufacture of semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589174B2 (en) * 1987-03-25 1997-03-12 アンプ・インコーポレーテッド Electrical connector assembly
JPH01294382A (en) * 1988-05-20 1989-11-28 Riyousei Denso Kk Connector housing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067562A (en) * 1973-10-15 1975-06-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067562A (en) * 1973-10-15 1975-06-06

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592142U (en) * 1983-04-20 1984-01-09 セイコーエプソン株式会社 semiconductor integrated circuit
JPS60224248A (en) * 1984-04-23 1985-11-08 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPH0129064B2 (en) * 1984-04-23 1989-06-07 Oki Electric Ind Co Ltd

Also Published As

Publication number Publication date
JPS5826175B2 (en) 1983-06-01

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