JPS52122090A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS52122090A
JPS52122090A JP3848676A JP3848676A JPS52122090A JP S52122090 A JPS52122090 A JP S52122090A JP 3848676 A JP3848676 A JP 3848676A JP 3848676 A JP3848676 A JP 3848676A JP S52122090 A JPS52122090 A JP S52122090A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
pads
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3848676A
Other languages
Japanese (ja)
Other versions
JPS605060B2 (en
Inventor
Yasoji Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51038486A priority Critical patent/JPS605060B2/en
Publication of JPS52122090A publication Critical patent/JPS52122090A/en
Publication of JPS605060B2 publication Critical patent/JPS605060B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
    • H01L27/0222—Charge pumping, substrate bias generation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To obtain an IC device which can sufficiently take bias of substrate without increasing chip occupying area by effectively utilizing the margin portions between pads and scribing regions.
JP51038486A 1976-04-06 1976-04-06 Semiconductor integrated circuit device Expired JPS605060B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51038486A JPS605060B2 (en) 1976-04-06 1976-04-06 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51038486A JPS605060B2 (en) 1976-04-06 1976-04-06 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS52122090A true JPS52122090A (en) 1977-10-13
JPS605060B2 JPS605060B2 (en) 1985-02-08

Family

ID=12526578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51038486A Expired JPS605060B2 (en) 1976-04-06 1976-04-06 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS605060B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device
JPH05129529A (en) * 1991-10-31 1993-05-25 Nec Corp Semiconductor input protective device
JPH05326844A (en) * 1992-05-20 1993-12-10 Nec Yamagata Ltd Semiconductor integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164546A (en) * 1981-04-03 1982-10-09 Oki Electric Ind Co Ltd Semiconductor device
JPH0143458B2 (en) * 1981-04-03 1989-09-20 Oki Electric Ind Co Ltd
JPH05129529A (en) * 1991-10-31 1993-05-25 Nec Corp Semiconductor input protective device
JPH05326844A (en) * 1992-05-20 1993-12-10 Nec Yamagata Ltd Semiconductor integrated circuit

Also Published As

Publication number Publication date
JPS605060B2 (en) 1985-02-08

Similar Documents

Publication Publication Date Title
JPS543480A (en) Manufacture of semiconductor device
JPS5252582A (en) Device and production for semiconductor
JPS5269589A (en) Semiconductor capacity element
JPS52122090A (en) Semiconductor integrated circuit device
JPS538566A (en) Mounting structure of semiconductor ic circuit
JPS54104286A (en) Integrated circuit device
JPS5336184A (en) Semiconductor integrated circuit
JPS52119874A (en) Semi-conductor device
JPS5396781A (en) Integrated circuit device
JPS51117886A (en) Large scale semiconductor integrated circuit
JPS5413279A (en) Manufacture for semiconductor integrated circuit device
JPS53119692A (en) Semiconductor logic circuit device
JPS56118353A (en) Semiconductor integrated circuit device
JPS543467A (en) Semiconductor integrated circuit
JPS5372488A (en) Photo semiconductor device
JPS52147083A (en) Semiconductor devices and integrated circuit using the same
JPS5481077A (en) Semiconductor wafer
JPS5335388A (en) Semiconductor device
JPS5339087A (en) Integrated circuit
JPS5286092A (en) Semiconductor integrated circuit
JPS5433681A (en) Semiconductor integrated circuit device
JPS5411673A (en) Semiconductor chip
JPS53102684A (en) Semiconductor memory device
JPS51139287A (en) Semi-conductor integrated circuit device
JPS53110368A (en) Bonding pad for semiconductor device