JPS5481077A - Semiconductor wafer - Google Patents

Semiconductor wafer

Info

Publication number
JPS5481077A
JPS5481077A JP14902677A JP14902677A JPS5481077A JP S5481077 A JPS5481077 A JP S5481077A JP 14902677 A JP14902677 A JP 14902677A JP 14902677 A JP14902677 A JP 14902677A JP S5481077 A JPS5481077 A JP S5481077A
Authority
JP
Japan
Prior art keywords
chip
pad
semiconductor wafer
test
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14902677A
Other languages
Japanese (ja)
Inventor
Koji Hashiguchi
Yoshiaki Michiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14902677A priority Critical patent/JPS5481077A/en
Publication of JPS5481077A publication Critical patent/JPS5481077A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To facilitate an easy test for the wafer level by forming both the test pad and its wiring simultaneously with formation of the integrated circuit chip at the unused region within the semiconductor wafer.
CONSTITUTION: When the IC chip is formed on the wafer, test pad 2, wiring 3 plus connection wire 6 and 7 are formed at the unused region simultaneously with formation of IC chip 4a or 4b. Pad 2 can be formed in sufficiently large size compared with pad 5 within the chip. Thus, an assured contact is secured between the probe and the test pad, reducing the possibility of the chip breakdown.
COPYRIGHT: (C)1979,JPO&Japio
JP14902677A 1977-12-12 1977-12-12 Semiconductor wafer Pending JPS5481077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14902677A JPS5481077A (en) 1977-12-12 1977-12-12 Semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14902677A JPS5481077A (en) 1977-12-12 1977-12-12 Semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5481077A true JPS5481077A (en) 1979-06-28

Family

ID=15466036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14902677A Pending JPS5481077A (en) 1977-12-12 1977-12-12 Semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5481077A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832429A (en) * 1981-08-20 1983-02-25 Matsushita Electric Ind Co Ltd Integrated circuit device
JPS59172243A (en) * 1983-03-18 1984-09-28 Nippon Denso Co Ltd Ic wafer
US5956567A (en) * 1994-12-19 1999-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip and semiconductor wafer having power supply pads for probe test

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120259A (en) * 1974-07-26 1976-02-18 Dainippon Printing Co Ltd PURASUCHITSUKURENZUNOSEIZOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120259A (en) * 1974-07-26 1976-02-18 Dainippon Printing Co Ltd PURASUCHITSUKURENZUNOSEIZOHO

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832429A (en) * 1981-08-20 1983-02-25 Matsushita Electric Ind Co Ltd Integrated circuit device
JPS59172243A (en) * 1983-03-18 1984-09-28 Nippon Denso Co Ltd Ic wafer
US5956567A (en) * 1994-12-19 1999-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip and semiconductor wafer having power supply pads for probe test

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