JPS57164546A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57164546A
JPS57164546A JP4926581A JP4926581A JPS57164546A JP S57164546 A JPS57164546 A JP S57164546A JP 4926581 A JP4926581 A JP 4926581A JP 4926581 A JP4926581 A JP 4926581A JP S57164546 A JPS57164546 A JP S57164546A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
grid lines
dividing
region
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4926581A
Other languages
Japanese (ja)
Other versions
JPH0143458B2 (en
Inventor
Yoshio Umemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP4926581A priority Critical patent/JPS57164546A/en
Publication of JPS57164546A publication Critical patent/JPS57164546A/en
Publication of JPH0143458B2 publication Critical patent/JPH0143458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent a semiconductor substrate from being warped by a method wherein grid lines for dividing are made of relatively thin oxide film and metal layers are formed along and adjacent to the grid lines on the semiconductor substrate and protective films are formed on the metal layers. CONSTITUTION:Field oxide layers 12 are formed on a semiconductor substrate 11 and on a region A which composes grid lines for dividing of the semiconductor substrate 11 relatively thin oxide film 13 is formed. And platinum silicide layers 14 are formed adjacent to and near the region A which composes the grid lines for dividing on the semiconductor substrate 11. The whole surface other than the grid lines region A is covered by phosphorus silicate glass protective film 15. With this constitution, the semiconductor substrate is prevented from being warped by thermal stress produced between masking oxide film and the semiconductor substrate.
JP4926581A 1981-04-03 1981-04-03 Semiconductor device Granted JPS57164546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4926581A JPS57164546A (en) 1981-04-03 1981-04-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4926581A JPS57164546A (en) 1981-04-03 1981-04-03 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57164546A true JPS57164546A (en) 1982-10-09
JPH0143458B2 JPH0143458B2 (en) 1989-09-20

Family

ID=12825992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4926581A Granted JPS57164546A (en) 1981-04-03 1981-04-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57164546A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121851A (en) * 1982-12-28 1984-07-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS6255941A (en) * 1985-09-05 1987-03-11 Matsushita Electronics Corp Manufacture of semiconductor device
JPH02116739U (en) * 1990-02-28 1990-09-19
JPH02308551A (en) * 1989-05-23 1990-12-21 Nec Corp Semiconductor wafer
JP2012204568A (en) * 2011-03-25 2012-10-22 Sumitomo Electric Ind Ltd Semiconductor device manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498165A (en) * 1972-05-10 1974-01-24
JPS52122090A (en) * 1976-04-06 1977-10-13 Toshiba Corp Semiconductor integrated circuit device
JPS5457957A (en) * 1977-10-18 1979-05-10 Mitsubishi Electric Corp Production of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498165A (en) * 1972-05-10 1974-01-24
JPS52122090A (en) * 1976-04-06 1977-10-13 Toshiba Corp Semiconductor integrated circuit device
JPS5457957A (en) * 1977-10-18 1979-05-10 Mitsubishi Electric Corp Production of semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121851A (en) * 1982-12-28 1984-07-14 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPH0342505B2 (en) * 1982-12-28 1991-06-27
JPS6255941A (en) * 1985-09-05 1987-03-11 Matsushita Electronics Corp Manufacture of semiconductor device
JPH02308551A (en) * 1989-05-23 1990-12-21 Nec Corp Semiconductor wafer
JPH02116739U (en) * 1990-02-28 1990-09-19
JP2012204568A (en) * 2011-03-25 2012-10-22 Sumitomo Electric Ind Ltd Semiconductor device manufacturing method

Also Published As

Publication number Publication date
JPH0143458B2 (en) 1989-09-20

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