JPS5395577A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS5395577A
JPS5395577A JP965377A JP965377A JPS5395577A JP S5395577 A JPS5395577 A JP S5395577A JP 965377 A JP965377 A JP 965377A JP 965377 A JP965377 A JP 965377A JP S5395577 A JPS5395577 A JP S5395577A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
overflow
proof
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP965377A
Other languages
Japanese (ja)
Inventor
Kazuo Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP965377A priority Critical patent/JPS5395577A/en
Publication of JPS5395577A publication Critical patent/JPS5395577A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Abstract

PURPOSE: To seal with overflow-proof for gold and tin brazing solders, by attaching the sealing ring at the edge surface of the ceramic package containing IC chip.
COPYRIGHT: (C)1978,JPO&Japio
JP965377A 1977-02-02 1977-02-02 Integrated circuit device Pending JPS5395577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP965377A JPS5395577A (en) 1977-02-02 1977-02-02 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP965377A JPS5395577A (en) 1977-02-02 1977-02-02 Integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5395577A true JPS5395577A (en) 1978-08-21

Family

ID=11726164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP965377A Pending JPS5395577A (en) 1977-02-02 1977-02-02 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5395577A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5915644B2 (en) * 2011-03-18 2016-05-11 株式会社大真空 Electronic component package, electronic component, and method of manufacturing electronic component package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5915644B2 (en) * 2011-03-18 2016-05-11 株式会社大真空 Electronic component package, electronic component, and method of manufacturing electronic component package

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