JPS5367358A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5367358A
JPS5367358A JP14260176A JP14260176A JPS5367358A JP S5367358 A JPS5367358 A JP S5367358A JP 14260176 A JP14260176 A JP 14260176A JP 14260176 A JP14260176 A JP 14260176A JP S5367358 A JPS5367358 A JP S5367358A
Authority
JP
Japan
Prior art keywords
semiconductor device
series
given
lead frames
glass sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14260176A
Other languages
Japanese (ja)
Other versions
JPS6155778B2 (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14260176A priority Critical patent/JPS5367358A/en
Publication of JPS5367358A publication Critical patent/JPS5367358A/en
Publication of JPS6155778B2 publication Critical patent/JPS6155778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE: To obtain a semiconductor device which is given a glass sealing using a ceramic container and a series of lead frames.
COPYRIGHT: (C)1978,JPO&Japio
JP14260176A 1976-11-27 1976-11-27 Semiconductor device Granted JPS5367358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14260176A JPS5367358A (en) 1976-11-27 1976-11-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14260176A JPS5367358A (en) 1976-11-27 1976-11-27 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5367358A true JPS5367358A (en) 1978-06-15
JPS6155778B2 JPS6155778B2 (en) 1986-11-29

Family

ID=15319093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14260176A Granted JPS5367358A (en) 1976-11-27 1976-11-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5367358A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190043U (en) * 1984-05-25 1985-12-16 関西日本電気株式会社 flat package
US4801996A (en) * 1987-10-14 1989-01-31 Hewlett-Packard Company Gigahertz rate integrated circuit package incorporating semiconductive MIS power-line substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190043U (en) * 1984-05-25 1985-12-16 関西日本電気株式会社 flat package
US4801996A (en) * 1987-10-14 1989-01-31 Hewlett-Packard Company Gigahertz rate integrated circuit package incorporating semiconductive MIS power-line substrate

Also Published As

Publication number Publication date
JPS6155778B2 (en) 1986-11-29

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