JPS53142176A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS53142176A JPS53142176A JP5737877A JP5737877A JPS53142176A JP S53142176 A JPS53142176 A JP S53142176A JP 5737877 A JP5737877 A JP 5737877A JP 5737877 A JP5737877 A JP 5737877A JP S53142176 A JPS53142176 A JP S53142176A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- warp
- lead frame
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Abstract
PURPOSE: To eliminate the warp occurring after sealing by giving a backward warp to the lead frame by the amount of the warp of the lead frame when the resin sealing is carried out.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5737877A JPS53142176A (en) | 1977-05-17 | 1977-05-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5737877A JPS53142176A (en) | 1977-05-17 | 1977-05-17 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53142176A true JPS53142176A (en) | 1978-12-11 |
Family
ID=13053924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5737877A Pending JPS53142176A (en) | 1977-05-17 | 1977-05-17 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53142176A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4486364A (en) * | 1981-12-04 | 1984-12-04 | Stanley Electric Company, Ltd. | Method and apparatus for molding a synthetic resin lens for a light emitting diode |
JP2014167990A (en) * | 2013-02-28 | 2014-09-11 | Canon Inc | Method of producing packaging member and method of manufacturing electronic component |
-
1977
- 1977-05-17 JP JP5737877A patent/JPS53142176A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4486364A (en) * | 1981-12-04 | 1984-12-04 | Stanley Electric Company, Ltd. | Method and apparatus for molding a synthetic resin lens for a light emitting diode |
JP2014167990A (en) * | 2013-02-28 | 2014-09-11 | Canon Inc | Method of producing packaging member and method of manufacturing electronic component |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS53142176A (en) | Manufacture of semiconductor device | |
JPS53124068A (en) | Lead frame | |
JPS53133371A (en) | Lead frame of plastic package for integrated circuit | |
JPS5375762A (en) | Semiconductor device | |
JPS53138284A (en) | Manufacture for semiconductor part | |
JPS542662A (en) | Semiconductor device | |
JPS5366169A (en) | Lead frame for resin charging | |
JPS5310968A (en) | Pellet bonding method | |
JPS5417482A (en) | Controlled output circuit | |
JPS51148693A (en) | Method for collecting iodine | |
JPS5410682A (en) | Production of semiconductor elements | |
JPS532079A (en) | Frame structure for semiconductor device and its manufacture | |
JPS5418280A (en) | Resin sealed semiconductor device | |
JPS547866A (en) | Manufacture for semiconductor device | |
JPS53136962A (en) | Frame for semiconductor device | |
JPS53114673A (en) | Resin sealing type semiconductor device | |
JPS5411671A (en) | Sealing method of semiconductor device | |
JPS51139775A (en) | Method of forming projection electrode | |
JPS5214361A (en) | Semiconductor device sealed with resin | |
JPS53128980A (en) | Positioning device for bonding | |
JPS5231671A (en) | Sealing method of semiconductor device | |
JPS51120686A (en) | Semiconductor pressure converter | |
JPS51112292A (en) | Semiconductor device | |
JPS5367358A (en) | Semiconductor device | |
JPS538567A (en) | Sealing structure of semiconductor device |