JPS53133371A - Lead frame of plastic package for integrated circuit - Google Patents

Lead frame of plastic package for integrated circuit

Info

Publication number
JPS53133371A
JPS53133371A JP4921977A JP4921977A JPS53133371A JP S53133371 A JPS53133371 A JP S53133371A JP 4921977 A JP4921977 A JP 4921977A JP 4921977 A JP4921977 A JP 4921977A JP S53133371 A JPS53133371 A JP S53133371A
Authority
JP
Japan
Prior art keywords
lead frame
integrated circuit
plastic package
frame
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4921977A
Other languages
Japanese (ja)
Inventor
Ikuo Kawamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4921977A priority Critical patent/JPS53133371A/en
Publication of JPS53133371A publication Critical patent/JPS53133371A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a low-cost lead frame by covering with Al at least part of the surface of the frame.
COPYRIGHT: (C)1978,JPO&Japio
JP4921977A 1977-04-27 1977-04-27 Lead frame of plastic package for integrated circuit Pending JPS53133371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4921977A JPS53133371A (en) 1977-04-27 1977-04-27 Lead frame of plastic package for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4921977A JPS53133371A (en) 1977-04-27 1977-04-27 Lead frame of plastic package for integrated circuit

Publications (1)

Publication Number Publication Date
JPS53133371A true JPS53133371A (en) 1978-11-21

Family

ID=12824825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4921977A Pending JPS53133371A (en) 1977-04-27 1977-04-27 Lead frame of plastic package for integrated circuit

Country Status (1)

Country Link
JP (1) JPS53133371A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161351A (en) * 1982-03-18 1983-09-24 Fujitsu Ltd Glass sealed semiconductor device
JPS592355A (en) * 1982-06-28 1984-01-07 Fujitsu Ltd Lead frame for semiconductor package and semiconductor device using said lead frame
JPS6237953A (en) * 1985-08-12 1987-02-18 Shinko Electric Ind Co Ltd Manufacture of lead frame
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
US5162894A (en) * 1988-05-24 1992-11-10 Kabushiki Kaisha Toshiba Semiconductor integrated circuit having a dummy lead and shaped inner leads

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161351A (en) * 1982-03-18 1983-09-24 Fujitsu Ltd Glass sealed semiconductor device
JPS592355A (en) * 1982-06-28 1984-01-07 Fujitsu Ltd Lead frame for semiconductor package and semiconductor device using said lead frame
JPS6237953A (en) * 1985-08-12 1987-02-18 Shinko Electric Ind Co Ltd Manufacture of lead frame
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
US5162894A (en) * 1988-05-24 1992-11-10 Kabushiki Kaisha Toshiba Semiconductor integrated circuit having a dummy lead and shaped inner leads

Similar Documents

Publication Publication Date Title
JPS5394875A (en) Package for semiconductor element
JPS53133371A (en) Lead frame of plastic package for integrated circuit
JPS53137646A (en) Ddc unit
JPS5336656A (en) Current mirror circuit
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS5285474A (en) Semiconductor device
JPS5366169A (en) Lead frame for resin charging
JPS538072A (en) Semiconductor device
JPS5325360A (en) Production of semiconductor device
JPS5422770A (en) Lead frame
JPS547866A (en) Manufacture for semiconductor device
JPS5254373A (en) Packaging construction for semiconductor element
JPS5346222A (en) Solid state pick up unit
JPS53142176A (en) Manufacture of semiconductor device
JPS5418280A (en) Resin sealed semiconductor device
JPS5339866A (en) Packaging method of semiconductor device
JPS5422775A (en) Semiconductor device
JPS5372567A (en) Semiconductor device
JPS52124820A (en) Production of cabinet
JPS53144671A (en) Production of semiconductor device
JPS5315759A (en) Electronic parts
JPS53144236A (en) Electronic circuit
JPS5314542A (en) Non-stable multi-vibrator
JPS53136962A (en) Frame for semiconductor device
JPS53122368A (en) Carrier tape