JPS53133371A - Lead frame of plastic package for integrated circuit - Google Patents
Lead frame of plastic package for integrated circuitInfo
- Publication number
- JPS53133371A JPS53133371A JP4921977A JP4921977A JPS53133371A JP S53133371 A JPS53133371 A JP S53133371A JP 4921977 A JP4921977 A JP 4921977A JP 4921977 A JP4921977 A JP 4921977A JP S53133371 A JPS53133371 A JP S53133371A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- integrated circuit
- plastic package
- frame
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a low-cost lead frame by covering with Al at least part of the surface of the frame.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4921977A JPS53133371A (en) | 1977-04-27 | 1977-04-27 | Lead frame of plastic package for integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4921977A JPS53133371A (en) | 1977-04-27 | 1977-04-27 | Lead frame of plastic package for integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53133371A true JPS53133371A (en) | 1978-11-21 |
Family
ID=12824825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4921977A Pending JPS53133371A (en) | 1977-04-27 | 1977-04-27 | Lead frame of plastic package for integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53133371A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161351A (en) * | 1982-03-18 | 1983-09-24 | Fujitsu Ltd | Glass sealed semiconductor device |
JPS592355A (en) * | 1982-06-28 | 1984-01-07 | Fujitsu Ltd | Lead frame for semiconductor package and semiconductor device using said lead frame |
JPS6237953A (en) * | 1985-08-12 | 1987-02-18 | Shinko Electric Ind Co Ltd | Manufacture of lead frame |
US4684975A (en) * | 1985-12-16 | 1987-08-04 | National Semiconductor Corporation | Molded semiconductor package having improved heat dissipation |
US5162894A (en) * | 1988-05-24 | 1992-11-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit having a dummy lead and shaped inner leads |
-
1977
- 1977-04-27 JP JP4921977A patent/JPS53133371A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161351A (en) * | 1982-03-18 | 1983-09-24 | Fujitsu Ltd | Glass sealed semiconductor device |
JPS592355A (en) * | 1982-06-28 | 1984-01-07 | Fujitsu Ltd | Lead frame for semiconductor package and semiconductor device using said lead frame |
JPS6237953A (en) * | 1985-08-12 | 1987-02-18 | Shinko Electric Ind Co Ltd | Manufacture of lead frame |
US4684975A (en) * | 1985-12-16 | 1987-08-04 | National Semiconductor Corporation | Molded semiconductor package having improved heat dissipation |
US5162894A (en) * | 1988-05-24 | 1992-11-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit having a dummy lead and shaped inner leads |
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